en.Wedoany.com Reported - The 2026 Bay Area Semiconductor Conference (WESEMiBAY Semiconductor Conference 2026) will be held from October 13 to 16, 2026, at the Shenzhen Convention and Exhibition Center (Futian). With the theme "Chip to the Future, Smart Innovation Ecosystem," the conference leverages the industrial advantages of the Guangdong-Hong Kong-Macao Greater Bay Area, aiming to connect global resources and gather forces across the upstream and downstream of the industry chain.

This conference is organized by WESEMiBAY. The total exhibition area covers 70,000 square meters, encompassing IC design/AI infrastructure, wafer manufacturing, compound semiconductors, advanced packaging, and other segments of the industry chain. It is expected to attract over 800 exhibitors and more than 70,000 professional visitors. The conference focuses on five core modules, building a full-chain exchange system for industry trend analysis, cutting-edge technology breakthroughs, academic theoretical discussions, and commercial project implementation.

The five core modules include: the WESEMiBAY Opening Ceremony and Semiconductor Industry Development Summit (2026.10.14), the Bay Area Integrated Circuit Science and Technology Conference (2026.10.14-16), New Product Launch Events (2026.10.14-16), a Series of Technical Forums (2026.10.14-16), and High-End Thematic Activities (2026.10.13-16).

The Opening Ceremony and Semiconductor Industry Development Summit is scheduled for the afternoon of October 14. As the highest-level event of the conference, it will bring together leading figures from government, industry, academia, research, application, capital, services, and finance to discuss topics such as global supply chain layout, AI computing power, semiconductor independent innovation, and development paths in the post-Moore era.

The conference will collaborate with Chip Journal to launch the Bay Area Integrated Circuit Science and Technology Conference (referred to as the "Bay Chip Technology Conference"), spanning three days with six academic sessions covering materials and novel devices, design and system integration, packaging, testing, and reliability, advanced manufacturing and processes, future semiconductor intelligent manufacturing, and post-Moore cross-paradigm frontier interdisciplinary directions. The conference will solicit high-quality academic papers globally, selecting outstanding results for publication in Chip Journal.

From October 14 to 16, a dedicated New Product Launch session will run for three consecutive days, providing exhibitors with a "launch equals exposure" promotional platform to showcase annual breakthrough chips, core equipment, key materials, and comprehensive solutions.

The conference will host 18 professional technical forums, divided into four vertical themes: IC design, wafer manufacturing, compound semiconductors, and advanced packaging, with an additional industry insight session. The forums will focus on core areas such as independent innovation in upstream materials and core equipment, industrial implementation of wide bandgap semiconductors, Chiplet integration technology, RISC-V ecosystem development, and AI chip and high-end memory R&D.

The conference will feature six high-end concurrent thematic activities, including a closed-door strategic meeting for the global TOP 20 executives, the Bay Area Semiconductor Night and Bay Chip Award Ceremony, the Third Bay Area Semiconductor Investment and Financing Strategic Development Forum, and the China Manufacturing Going Global International Supply-Demand Matchmaking Conference.

The conference schedule is as follows: October 13, Strategic Foresight Day (high-end closed-door seminars); October 14, Grand Opening Day (WESEMiBAY and Bay Chip Technology Conference opening, Industry Development Summit, multiple technical forums, Bay Area Semiconductor Night); October 15, Technical Deep Dive Day (full-track technical discussions, investment and financing forum, going global matchmaking); October 16, Industry Insight Day (focusing on global and industry trends).

Currently, recruitment for speakers and corporate sponsors for the 2026 Bay Area Semiconductor Conference has begun. The conference is seeking technical experts, corporate executives, and academic leaders from all segments of the global semiconductor industry chain to serve as speakers. Additionally, the conference offers a multi-tier sponsorship system, including diamond and gold levels, covering core benefits such as forum naming rights, keynote speeches, full media exposure, and priority scheduling for new product launches.