China's 3PEAK Exhibits 800G/1.6T Optical Communication Chips at 2026 CIOE

en.Wedoany.com Reported - From September 9 to 11, 2026, 3PEAK (Stock Code: 688536) exhibited multiple optical communication analog and mixed-signal chip solutions at the 2026 CIOE (China International Optoelectronic Exposition). As a supplier of high-performance analog and mixed-signal products, 3PEAK's exhibits included: 800G/1.6T pluggable high-speed optical module solutions compatible with both silicon photonics and EML routes, CPO/NPO co-packaged optics and ELSFP external light source mass-production-grade supporting solutions, OCS all-optical switching complete control solutions, and coherent optical module and EDFA optical amplification full-link solutions.

3PEAK CEO Wu Jiangang stated that the explosive growth in AI computing demand is driving accelerated iteration in the optical communication industry. As optical modules evolve from 800G to 1.6T and even higher speeds, unprecedented challenges are being posed to analog chips in terms of integration density, power consumption, and performance. 3PEAK has deep expertise in high-performance analog and mixed-signal chips and has established a multi-tiered, full-category product portfolio spanning optical modules, CPO, servers, and other application directions. The company is committed to helping customers address complex challenges in high-speed optical interconnect design with higher-integration, lower-power, and more reliable chip solutions, driving the optical communication industry to new heights.

For 800G/1.6T pluggable high-speed optical modules, 3PEAK provides a one-stop analog chip supporting solution covering both silicon photonics and EML technology routes to meet the demands of AI computing centers for high-speed optical modules. On the silicon photonics route, its high-precision silicon photonics AFE products TPAFEA003A/TPAFEA003B and TPAFEA005 are custom-developed for 800G/1.6T silicon photonics modules. A single chip can replace two or more traditional AFE devices, with integrated multi-channel DACs, heater drivers, multiple IOs, and ADCs. These chips deliver both high-current laser driving capability and low overall system power consumption. They are compatible with various mainstream PIC photonic chips, forming a complete device matrix that enables full-link functions including optical power monitoring, temperature control, and signal acquisition.

On the EML route, the TPAFEA108 and TPAFEA008 feature built-in negative voltage bias circuits, lowering the barrier for laser debugging and making them suitable for cluster short-distance high-speed interconnect scenarios. The TPAFEA108 highly integrates the signal chain and power supply, significantly reducing the number of peripheral components, thereby lowering overall system cost and PCB layout difficulty. Subsequent iterative products are planned to increase channel density and optimize noise metrics to meet the development needs of 1.6T EML optical modules. The complete solution employs low-noise power devices to ensure stable high-bandwidth, high-extinction-ratio output from the modules; in addition to optical transceivers, it can also be used in test and measurement instruments and other equipment.

For next-generation high-density optoelectronic integration technologies, 3PEAK's two complete solutions—CPO/NPO co-packaged optics and ELSFP external light source—have both passed customer validation, helping customers shorten product development cycles and accelerate time-to-market.

For CPO/NPO optical engines, 3PEAK has built a full-dimensional chip matrix covering multi-channel high-precision AFEs, low-noise LDOs, high-speed interfaces, and temperature monitoring. Given the limited internal space of co-packaged architectures, these products have been specifically optimized for miniaturization and low noise, enabling core functions such as laser bias adjustment, modulator bias voltage control, and real-time optical power feedback, helping customers develop compact, highly reliable optical engine products.

The core of the ELSFP external light source solution is the TPAFEA003A/B multi-channel IDAC laser driver, paired with the dual-channel low-ripple Buck chip TPP205307. This combination delivers low output ripple and fast transient response, suppressing power supply noise interference with the laser; the dual independent outputs simplify the overall power architecture and ensure stable continuous-wave laser output. 3PEAK plans to subsequently launch the TPAFEA009 integrated discrete IP solution to further optimize PCB layout and reduce overall system cost. The complete solution supports hot-swapping and redundancy design, ensuring long-term stable operation of external light sources in AI clusters and data centers.

In the data center all-optical switching (OCS) scenario, 3PEAK showcased its OCS all-optical switching complete control solution. This solution includes multi-channel high-precision driving for optical switch arrays, channel status monitoring, and system control logic. Based on 3PEAK's product portfolio in multi-channel analog front-ends, high-precision data converters, interface and logic devices, it provides a one-stop chip solution from drive control to status monitoring.

The multi-channel high-precision driver chip TPC2400 used in the solution is specifically designed for optical switch arrays. It provides multiple independent channels and high-precision current output, supports fast channel switching, and integrates status detection functionality to provide real-time feedback on switch operating status, thereby reducing peripheral circuit complexity.

3PEAK has accumulated a mature product portfolio and customer mass-production experience in the OCS field. At the booth, the company highlighted its high-precision multi-channel driving and control technology for optical switch arrays, which can help data centers build more efficient and flexible all-optical switching networks.

In the coherent optical module and EDFA optical amplification full-link solution, the coherent optical module employs multi-channel digital-to-analog converter chips TPAFEA003A/B and TPC2190, paired with precision operational amplifiers TPA597x/599x and logarithmic amplifier TPA8304, to meet the stringent requirements of coherent systems for high linearity, low phase noise, and low power consumption. For EDFA erbium-doped fiber amplifier scenarios, the solution uses logarithmic amplifiers to precisely detect pump optical power, achieving lossless amplification of fiber link signals. Currently, multiple signal chain and power management chips within this solution have achieved large-scale mass production shipments, continuously ensuring signal transmission quality over long-haul transmission links.

3PEAK is a leading domestic enterprise in high-performance analog and mixed-signal chips, with business covering four major downstream sectors: general communications, general industrial, automotive, and consumer electronics. The company has cumulatively mass-produced over 3,200 product models and has achieved breakthroughs in more than 30 core product areas including signal chains and power management. As optical modules upgrade from 800G to higher-specification 1.6T, 3PEAK has established a multi-tiered, high-barrier product portfolio. The company will continue to focus on high-speed optical interconnect technology iteration, expand high-value product lines, strengthen its core competitiveness in optical communication analog chips, and support the independent innovation and upgrading of China's optical communication industry.