en.Wedoany.com Reported - Murata Manufacturing Co., Ltd. (Tokyo Stock Exchange: 6981, ISIN: JP3914400001) announced a collaboration with Synopsys, Inc., enabling users of Synopsys simulation tools to navigate directly from within the tool to the Murata website to access and download Murata's latest high-performance simulation models. The collaboration covers Synopsys' 3D electromagnetic field analysis tool Ansys HFSS and thermal analysis tool Ansys Icepak. Based on its research as of June 15, 2026, Murata has also become the first supplier to offer simulation models for passive components through Ansys Icepak.

The continuous growth in demand for high-speed, high-capacity communication is making electronic circuit design increasingly complex. During the design phase, engineers must simultaneously consider physical phenomena such as electromagnetic interference (EMI) and component heat generation. Failure to address these issues early in the design process can lead to costly redesigns, extended development time, and increased prototyping costs. This trend places higher demands on electronic component suppliers to provide ready-to-use, high-quality simulation models compatible with commonly used design tools.

Developing accurate electromagnetic and thermal analysis models is challenging because electromagnetic behavior and temperature distribution can vary significantly with design conditions. Murata employs a vertically integrated model spanning from raw material development and manufacturing to final product processing, leveraging extensive proprietary datasets to generate simulation models that closely reflect actual component performance.

These models are compatible with the Ansys 2026 R1 release. Specifically, Ansys HFSS is used for electromagnetic field analysis of RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak is used for thermal analysis of power inductors.

Looking ahead, Murata plans to further deepen its collaboration with Synopsys to expand its model product line, supporting more advanced and efficient electronic design processes.

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