Xiaomi Unveils Its First AI Flagship SoC, Xuanjie O3: 24 Billion Transistors, 3nm Process
2026-08-24 14:34
Favorite
en.Wedoany.com Reported - On August 24, Xiaomi unveiled its first AI flagship SoC, the Xuanjie O3, at the Xuanjie Chip Technology Communication Conference. According to information disclosed by Xiaomi, the Xuanjie O3 adopts a 3nm process and integrates 24 billion transistors, marking a 26% increase in transistor scale compared to the previous generation.
In terms of chip scale, the Xuanjie O3 has a die area of 133mm². Xiaomi stated that the chip's architecture has been upgraded.
This bulletin is compiled and reposted from information of global Internet and strategic partners, aiming to provide communication for readers. If there is any infringement or other issues, please inform us in time. We will make modifications or deletions accordingly. Unauthorized reproduction of this article is strictly prohibited. Email: news@wedoany.com
Related Products
Negotiable
MUX Series Communication Interface Device for Security and Stability Control System
Nanjing NR Electric Co., Ltd.
Negotiable
Mine Explosion-proof and Intrinsically Safe Industrial Ethernet Ring Network (10 Gigabit/Gigabit)
Chongqing Mas Sci&Tech Co., Ltd.
Negotiable /Unit
Multi-function Marine Monitoring Low-altitude Detection Radar Sea-air Boundary Ocean Dynamic Environment Measurement
Chengdu Dixin Technology Co., Ltd.
Negotiable
KJD127(A) Mining Explosion-Proof and Intrinsically Safe Computer
Taiyuan Xiangming Intelligent Control Technology Co., Ltd.
Negotiable
Flat Portable Satellite Terminal 0.35m Aperture Manual Portable Terminal
China Starwin Science & Technology Co., Ltd.
Negotiable
One-Stop Steward Service for the Entire Logistics System Integration Chain
Zhongding Intelligent (Wuxi) Technology Co., Ltd.
Negotiable /piece
Hot Selling 10 Inch Intel N5100 I5 I7 FHD 8 +128GB 16+256GB Win10 Pro Win11 Pro 4G 5G Rugged Tablet PC Pad with NFC Barcode
Highton Electronics Co., Ltd.
Negotiable
GYTA Type Non-Self-Supporting Aerial/Duct Optical Cable
TONGDING INTERCONNECTION INFORMATION CO., LTD. Related Reading
EMD Electronics Opens 3,500-Square-Meter Semiconductor Materials R&D Center in the United States
2026-10-07
SpaceX Plans to Raise $40 Billion to Purchase Nvidia Chips
2026-10-07
Skyworks Completes Merger with Qorvo, Expects $500 Million in Annual Cost Synergies
2026-10-06
Vanguard and NXP Consider Building a Second 12-Inch Chip Fab in Singapore
2026-10-04
Infineon to Open New Plant in Thailand on October 1, with Investment Exceeding 48 Billion Baht
2026-10-01
Qualcomm Evaluates Samsung's 2nm Process for Next-Generation Mobile Chips
2026-09-29
Samsung Electro-Mechanics to Invest KRW 4.27 Trillion to Expand Packaging Substrate Capacity in South Korea
2026-09-28
France's SiPearl Delivers First Batch of Rhea1 Processors for European Exascale Supercomputer
2026-09-28
China's Archimedes Semiconductor Completes First Batch Delivery of Diamond SiC Modules
2026-09-28
China's Montage Technology Achieves Mass Production of DDR5 Fifth-Generation RCD Chip
2026-09-28
Related Video
Why are chips the most complex manufacturing feat in human history? Understand the entire CPU creation process in 7 minutes.
00:07:04
Benefits of Artificial Intelligence AI Machine Learning Algorithms Statistics
00:00:50
Utah has approved a data center twice the size of manhattan which will consume the water of 25000 Olympic pools
00:01:03
AI data centers are using huge amounts of water as demand for artificial intelligence continues to grow.
00:01:44
The $200M Machine that Prints Microchips: The EUV Photolithography System part 2#EUV#ASML#Microchips
00:02:14