American Excavator Attachment Manufacturer Joins Open-S Alliance
American attachment manufacturer Werk-Brau has announced its membership in the Open-S Alliance, beco...
Stratasys Expands Additive Manufacturing Product Line in the US
Stratasys recently launched multiple new additive manufacturing products in the United States, inclu...
SYNAOS Collaborates with Rockwell Automation Subsidiary to Advance Mobile Robot Interoperability
SYNAOS, an intelligent intralogistics software provider, recently entered a strategic partnership wi...
EU and US Near Agreement on Critical Minerals Cooperation
The European Union and the United States are close to reaching a critical minerals cooperation agree...
CoreWeave Signs Multi-Year Agreement with Anthropic, Claude Model Compute Deployment to Begin This Year
On April 10, 2026, CoreWeave announced a multi-year agreement with Anthropic to provide cloud infras...
Anthropic Launches Project Glasswing, JPMorgan Chase Gains Access to Mythos Model as Partner
On April 8, 2026, Anthropic announced via its official blog the official launch of "Project Glasswin...
OpenAI Proactively Revokes Certificates and Hardens Applications, Confirms User Data Unaffected in Axios Incident
On April 10, 2026, OpenAI issued an official security statement confirming it had initiated a compre...
SpaceX is Recruiting RF Front-End Engineers to Develop Its Own Chip Modules for Starlink Mobile Services.
SpaceX released a job posting in April 2026, seeking a Senior RF Front-End Module Design Engineer fo...
Intel Unveils 300mm Silicon-based GaN Chiplet, 19 Microns Thin with Integrated Digital Control Circuitry
Intel Foundry's research team showcased a pioneering GaN chiplet technology based on 300mm silicon w...
Broadcom Releases Automic Automation V26, Enhancing VMware Integration and Automation Control with AI Technology
Broadcom recently released version 26 of its Automic Automation IT control system, introducing artif...