Due to the inherent material properties of silicon carbide (wide bandgap, high breakdown field strength, low on-resistance, low thermal resistance, etc.), silicon carbide devices, compared to silicon-based components, are suitable for high junction temperatures, high breakdown voltages, high power, and large currents, meeting the new development demands of the power electronics industry.
o Silicon Carbide Schottky Barrier Diode (SiC SBD)
Ultra-fast switching speed and minimal reverse recovery current significantly reduce switching losses, achieving outstanding energy efficiency.
o Silicon Carbide Field-Effect Transistor (SiC MOSFET)
Low loss, faster switching speed, high blocking voltage, capable of operating in high-temperature environments, enabling system miniaturization.
o Silicon Carbide Power Module (SiC Power Module)
Modular integrated packaging of multiple silicon carbide chips further enhances the current capacity of silicon carbide power devices. Compared to silicon-based power modules, both switching losses and volume are significantly reduced. Its unique advantages, including high voltage, large current, high temperature, high frequency, and low loss, greatly improve existing energy conversion efficiency.


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