en.Wedoany.com Reported - Beijing Worldia Diamond Tools Co., Ltd. recently showcased various innovative products, focusing on the precision machining field of hard and brittle materials. Zhang Shifeng, General Sales Manager of the company's Precision Cutting Tools Business Unit, gave an exclusive interview, introducing the application of the superhard micro milling cutter series in high-end manufacturing sectors such as semiconductors, automotive, and aerospace.

Worldia is launching three major superhard micro milling cutter series this time, targeting high-hardness brittle materials like monocrystalline silicon, silicon carbide, and sapphire. The PCD/CVDD superhard micro milling cutter series includes both dense-tooth and sparse-tooth structures, capable of customizing non-standard profiles, achieving over 98% light transmittance in quartz processing for up to 15 hours of continuous machining. The superhard helical micro milling cutter series is suitable for deep-cavity precision machining with diameters within 3mm, featuring a cutting edge length of up to 20 times the diameter. The PCB superhard spiral drill bit is made of integral PCD, with a minimum diameter of 0.5mm, and is suitable for drilling carbon fiber and PCBs. Actual tests show that this tool achieves profile control of Rq 30 nanometers in glass side-finishing, with a lifespan three times that of traditional tools; in blind hole machining of cemented carbide molds, it improves efficiency by 1.67 times and extends lifespan by approximately 15 times.
Worldia is shifting from product export to brand and technology going global. Since expanding overseas in 2012, it has established service centers in Europe and built a factory in Mexico providing tool sharpening and sampling services. In 2026, Worldia plans to strengthen promotions in Türkiye and seek collaborations. Despite increasing market competition, Worldia's precision cutting tools business saw stable growth in 2025. Moving forward, the company will continue to optimize cutting tools for hard and brittle materials, launch economical products, and provide more suitable solutions for the semiconductor, aerospace, new energy, and medical fields.
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