Germany's SUSS and Manz Asia Partner to Develop Inkjet Equipment for Advanced Semiconductor Packaging

en.Wedoany.com Reported - German semiconductor equipment manufacturer SUSS has announced a strategic partnership with Manz Asia to jointly develop next-generation inkjet coating technology and equipment for semiconductor manufacturing and advanced packaging. The two parties will focus on advancing panel-level packaging applications, material and process validation, and inkjet solutions suitable for large-scale semiconductor manufacturing. Market forecasts cited by SUSS show that by 2030, the global annual serviceable market for semiconductor inkjet application equipment is expected to exceed US$800 million.

Under the collaboration, SUSS will provide semiconductor process equipment, advanced packaging technology, and global customer resources, while Manz Asia will contribute inkjet printing technology, manufacturing engineering experience, and panel-level packaging process capabilities. The two parties will jointly carry out new application development, material adaptation, process parameter validation, and manufacturing process optimization to drive the transition of inkjet technology from process R&D to large-scale semiconductor production.

Manz Asia's existing inkjet development platform covers material and substrate preparation, inkjet printing, curing, and process characterization, adopting a technology development model that spans from laboratory R&D to factory manufacturing. The company also possesses capabilities in electrochemical deposition, wet chemistry, digital printing, automation, and software integration, with business coverage in fan-out panel-level packaging, CoPoS packaging, and glass and organic core IC substrate processing.

Inkjet coating technology enables selective material deposition at predetermined locations, reducing material consumption compared with traditional full-surface coating processes, and is suitable for coating deposition on complex three-dimensional structures. The two parties will develop corresponding process and equipment solutions addressing the requirements of advanced semiconductor packaging for material utilization, processing precision, and large-size substrate manufacturing.

SUSS has included inkjet technology in its long-term business growth strategy and plans to expand its technology footprint in advanced packaging and panel-level packaging through this collaboration. Manz Asia previously established an inkjet technology partnership with Epson on March 12, 2026, to jointly develop a semiconductor inkjet equipment series covering R&D, pilot, and mass production stages. This collaboration with SUSS will further expand its scope of inkjet process development and industrialization partnerships.