SK hynix Plans to Maximize M15X Fab Capacity by Year-End

en.Wedoany.com Reported - On October 28, South Korean memory chip maker SK hynix announced a new capacity expansion plan while reporting its third-quarter 2026 results, preparing to maximize capacity at its Cheongju M15X fab by the end of the year to scale up production of sixth-generation high bandwidth memory (HBM4). The company expects both HBM4 shipments and revenue to surpass HBM3E in the fourth quarter, making it the mainstay product of its high bandwidth memory business.

SK hynix will also increase the production share of its sixth-generation 10nm-class (1c) DRAM process and expand sales of DDR5 and LPDDR5 SOCAMM products for AI servers. In the third quarter, the company fully ramped up HBM4 shipments, saw significant growth in server DDR5 sales, and continued to expand sales of 321-layer TLC enterprise SSDs.

NAND flash production will advance in parallel with the transition to advanced processes. SK hynix plans to raise the share of its 321-layer NAND process in domestic capacity to more than 50% in the fourth quarter, increase supply of high-performance, high-capacity enterprise SSDs (eSSDs), and continue developing high bandwidth flash (HBF) and system optimization technologies.

The company has signed long-term supply agreements with 14 major customers, including global large-scale cloud service providers, locking in supply equivalent to more than 50% of its total capacity for 2027 and 2028. Under its capacity investment plan, the first phase of the Yongin wafer fab is scheduled to enter formal operations in 2027, and SK hynix expects investment in domestic and overseas production infrastructure to increase significantly next year.