Wedoany.com Report-Aug. 9, DIC Corporation, based in Tokyo, has announced plans to build a new epoxy resins production facility at its Chiba Plant in Ichihara, Chiba Prefecture. The investment has been approved by Japan’s Ministry of Economy, Trade and Industry (METI) as a “plan for ensuring stable supply” under the Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures. As a result, DIC is expected to receive a subsidy of up to ¥3 billion to support the project.

The new facility is scheduled to begin operations in July 2029. Once completed, it will increase DIC’s annual production capacity for epoxy resins used in semiconductor applications by approximately 60%. The expansion is aimed at addressing the rising demand for these materials, which are essential to the production of advanced semiconductor devices.

Epoxy resins are thermosetting synthetic materials known for their strong moldability, heat resistance, electrical insulation, and adhesive properties. They are widely used across multiple sectors, especially in electronics. DIC began manufacturing epoxy resins in 1968 and has since developed a comprehensive production system that integrates the entire process—from raw material selection to the final product. This approach has enabled the company to provide specialized solutions for the evolving needs of the electronics industry.

DIC’s epoxy resins play a key role in semiconductor fabrication, offering features such as heat resistance, dimensional stability, and reduced signal transmission loss. These qualities are critical to supporting the continued advancement of high-speed, high-capacity communication technologies. With global demand for semiconductors continuing to grow, securing a consistent supply of epoxy resins has become increasingly important.

Currently, the Chiba Plant’s existing epoxy resin facility lacks sufficient capacity to meet the projected increase in demand. The decision to construct a new facility adjacent to the current one is intended to enhance production capability over the medium to long term. In addition to expanding output, the new facility will incorporate updated production processes designed to improve product quality and manufacturing efficiency.

DIC’s investment reflects its commitment to supporting the semiconductor industry through stable supply and technological advancement. By expanding its capacity and modernizing its production infrastructure, the company aims to strengthen its position as a key supplier of materials essential to next-generation electronic components.