China's Hello Inc. Launches World's First Shared Bike with HiSilicon Chip and HarmonyOS
Hello Inc. has launched the world's first shared bike equipped with a HiSilicon chip and HarmonyOS, ...
Chen Shanzhi of China Information and Communication Technologies Group: V-PON Vehicle Optical Communication Completes 20,000 km Road Test
The inaugural meeting of the Vehicle Optical Communication Working Group and a seminar on key techno...
VIAVI Launches CX300 TETRA MS Option to Accelerate Testing
VIAVI Solutions Inc. has introduced the TETRA MS radio base station simulator option for its field-p...
Russia's Amur and Raidix Launch Software-Hardware Appliance
Amur and Raidix (Рэйдикс) have jointly launched a software-hardware appliance based on the Amur Terr...
Israel's Gilat Acquires Comtech Satellite Division for $157.5 Million
Israel's Gilat Satellite Networks Ltd. (NASDAQ: GILT) and Comtech Telecommunications Corp. (NASDAQ: ...
US-based PicoJool Launches 200G VCSEL Products for AI Optical Interconnects
Silicon Valley startup PicoJool has launched a series of 200G vertical-cavity surface-emitting laser...
TTP Develops 5G NTN Modem Module for Ku/Ka Bands
TTP plc is developing a new 5G NTN (Non-Terrestrial Network) modem module. Designed with a software-...
IMS2026: Narda-MITEQ Launches New Cryogenic RF Products for Space
Narda-MITEQ has unveiled several new products and feature enhancements at IMS2026, expanding its hig...
Rostelecom Shares Experience with Kaliningrad Operators on New Law Implementation
The Kaliningrad branch of PJSC Rostelecom is focusing on strengthening cooperation with regional tel...
Apple's First Foldable iPhone Ultra Delayed to Early 2027
Apple's first foldable smartphone, the iPhone Ultra, is now expected to launch in early 2027. After...
Intellian Activates Approximately 6,970 Square Meter Manufacturing Facility in the U.S.
Satellite communication solutions provider Intellian Technologies (인텔리안테크놀로지스) will officially activ...
Manz Asia Successfully Delivers World's First 310mm Panel-Level Packaging ECD Mass Production System
Manz Asia has successfully delivered the world's first 310mm×310mm panel-level packaging (PLP) elect...
South Korea's Chip Inflation Drives Set-Top Box Procurement Costs for Pay-TV Operators Up More Than Twofold
The boom in South Korea's semiconductor industry has given rise to "Chip Inflation," leading to a sh...
Jusung Engineering Ships World’s First Atomic Layer Growth Equipment to Global Semiconductor Company
Jusung Engineering announced on the 18th that it has supplied the world’s first atomic layer growth ...
Redmi Buds 8 Launched in Pakistan at Under 15,000 Rupees
Xiaomi has officially launched the Redmi Buds 8 true wireless earphones in the Pakistani market, fur...
Canada's BlackBerry QNX Expands into Industrial and Medical Sectors, Stock Price Doubles
BlackBerry's real-time operating system QNX is expanding its application scope from the automotive s...
OnePlus plans to launch N series phones in India, priced under 20,000 rupees
OnePlus plans to launch a new affordable N series in the Indian market to gain a larger market share...
China's Honor to Launch Smartphone with Industry's Largest Battery Capacity
On June 15, Honor announced that its new phone, the Honor X80 Pro Max, will feature a 11000mAh fourt...
China's Nexchip Sets Up Wholly-Owned Subsidiary to Expand Integrated Circuit Chip Manufacturing Business
Recently, Hefei Jingwei Technology Co., Ltd. was established, with legal representative Zhu Caiwei, ...
Japan's pSemi Launches Next-Generation DOCSIS 4.0 RF Switch
pSemi, a subsidiary of Murata Manufacturing, has introduced the new PE42727 UltraCMOS SPDT RF switch...
China's MeiG Smart Targets Overseas Revenue Share Exceeding 60%
MeiG Smart introduced its business operations during an investor relations event held on June 11.The...
US LightCounting: Q1 2026 Optical Module Sales Reach Approximately $10 Billion
The first quarter of 2026 was the most outstanding quarter for the optical module market. Optical co...
Samsung's Foldable Phone to Use 60-Micron-Thick UTG Glass
Samsung plans to launch a new foldable smartphone in 2026, which will feature ultra-thin glass (UTG)...
China's Vivo Launches X Fold6 with 8.02-Inch Display, 5000nit Brightness, and 200MP Camera
According to renowned leaker Digital Chat Station, Vivo is set to release its new foldable smartphon...
Japan Launches SoftBank Ymobile Limited-Time Price Cuts and Enhanced Contract Offers
SoftBank announced on the 12th that it has launched three campaigns on the Ymobile online store, inc...
2026 Memory Crisis Drives 25% Cost Increase for Low-End Phones, Threatening Digital Inclusion
The global memory chip market supply crunch is driving up smartphone costs, a phenomenon dubbed "RAM...
Lola Wireless GEN Launches Global Emergency Network Lola GEN in the U.S.
Telecom industry veterans, in collaboration with DAMM Cellular Systems, Hytera, and Hologram, have b...
US CTIA Releases Wireless Device Grading Standard Version 5.1
The Wireless Communications and Internet Association (CTIA) has released version 5.1 of its wireless...
China Micro-Nano Core Accelerates 3D Compute-in-Memory Chip Commercialization with Over 1 Billion Yuan in Series B Funding
Recently, Hangzhou Micro-Nano Core Electronics Technology Co., Ltd. completed its B3 and B4 funding ...
iFixit teardown reveals Trump Mobile T1 is actually a rebranded HTC U24 Pro
An iFixit teardown has revealed that the Trump Mobile T1 smartphone is virtually identical to the HT...