en.Wedoany.com Reported - Manz Asia has successfully delivered the world's first 310mm×310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass production system to a customer's production line. This system expands the company's advanced packaging equipment portfolio and integrates its in-house expertise in process innovation, equipment engineering, and high-volume manufacturing.
The new ECD platform is designed to support glass and metal square carriers, integrating wet chemical process modules for redistribution layer (RDL) manufacturing, and is specifically developed for advanced packaging architectures based on FOPLP, CoPoS, and TGV. The 310mm×310mm size offers advantages in scalability, panel utilization, and production yield, making it a key enabling technology for panel-level packaging, targeting AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect applications.
The Omni x series now includes the Omni 310x (310mm×310mm), Omni 510x (510mm×515mm), and Omni 700x (700mm×700mm), forming a scalable platform architecture for panel-level mass production. The modular system design supports flexible configuration based on device architecture, process flow, and capacity requirements, meeting the needs of R&D, qualification, pilot production, and high-volume manufacturing stages. This ECD system seamlessly integrates a full set of wet chemical process modules including cleaning, developing, etching, and stripping, and supports both spin and spray processing modes, forming a complete 310mm×310mm panel-level RDL manufacturing solution on the Omni 310x platform.
Advanced packaging is accelerating its integration with cutting-edge semiconductor process technologies, with manufacturing capacity increasingly concentrated in Taiwan, a trend driving the consolidation of process nodes and packaging architectures in the global semiconductor supply chain. Leveraging its in-house R&D capabilities and collaborations with leading IDMs and packaging customers, Manz Asia continues to accelerate technology iteration and mass production deployment.
Robert Lin, CEO of Manz Asia, stated that the successful deployment of the Omni 310x to a customer's production line reflects the growing market demand for advanced packaging platforms that combine flexibility with production readiness. He noted that as advanced packaging becomes increasingly central to AI and high-performance computing architectures, process control, scalability, and seamless integration with high-volume manufacturing environments have become key competitive differentiators. He added that Manz Asia will continue to advance the integration of ECD and wet chemical process technologies to improve manufacturing efficiency, yield stability, and capacity ramp-up capabilities, aiming to accelerate the deployment of next-generation packaging technologies in the fields of FOPLP, CoPoS, and TGV, while enhancing supply chain resilience within the semiconductor ecosystem. Through a multi-platform strategy spanning 310mm, 510mm, and 700mm, the company provides a consistent technology path from process development to high-volume manufacturing, with the Omni x series roadmap designed to support sustainable and scalable capacity expansion for next-generation semiconductor packaging applications.
About Manz Asia: The company provides semiconductor equipment and solutions based on core technologies including electrochemical deposition (ECD), wet chemistry, digital printing, automation, and software integration, with expertise spanning advanced packaging (FOPLP/CoPoS) and IC substrate processing (glass and organic cores), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales agency services, it helps customers accelerate time-to-market and improve yield.
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