A joint team led by the Institute of Metal Research, Chinese Academy of Sciences, invents a high-frequency silicon-graphene-germanium barristor
2026-06-08
With the large-scale deployment of 5G and the forward-looking exploration of 6G technology, the Internet of Things (IoT), ultra-high-speed sensing, and intelligent communication systems have placed un...
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University of Texas at Austin Develops Desktop EUV Lithography Device, Reducing 3D Chip Patterning to Minutes
2026-06-03
A research team from the Cockrell School of Engineering at the University of Texas at Austin has developed a desktop extreme ultraviolet (EUV) lithography device. Combined with volumetric 3D patternin...
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Breaking the "Catch-Up Narrative"! China's Huawei "Tao's Law" Initiates an Industry Marathon
2026-05-29
Recently, Huawei officially unveiled "Tao's Law (τ)," proposing "time-based scaling" as a replacement for "geometric scaling" as the guiding principle for semiconductor evolution. As a systematic summ...
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ModelBest Open-Sources the First End-Side Efficient Large Model Trained on a Domestic Computing Platform
2026-05-25
Recently, ModelBest, in collaboration with Tsinghua University and the OpenBMB open-source community, officially released and open-sourced its latest achievement in low-bit large model training—BitCPM...
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World's First Intelligent Transmission Electron Microscope System "Yuanyan-1" Successfully Developed
2026-05-25
On the 24th, the intelligent transmission electron microscope system (hereinafter referred to as the "Intelligent TEM System") developed by the team of Researcher Deng Dehui and Researcher Liu Wei fro...
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First! Chinese Research Team Achieves Key Breakthrough
2026-05-23
On May 21, it was learned from the Southern University of Science and Technology that a research team jointly led by Academician Xue Qikun, Professor He Junfeng from the University of Science and Tech...
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Major Breakthrough! Team from China's National University of Defense Technology Publishes Latest Chip-Scale Gyroscope Research in Nature!
2026-05-23
On May 20, a Chinese research team once again published innovative sensor research findings in the top academic journal Nature.
This research, based on the principles of cusp singularity physics, est...
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A First for China! JFS Laboratory Achieves Breakthrough in 8-Inch Atomic Layer Deposition of Molybdenum Metal Process
2026-05-21
The deposition precision of metal thin films directly determines the performance ceiling of devices. However, the low resistivity, high uniformity, and mass production-friendly process for molybdenum ...
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Belgium's imec showcases first quantum dot qubit device fabricated with High NA EUV lithography, achieving 6nm electrode pitch
2026-05-20
At the ITF World annual technology forum held in Antwerp on May 19, the Belgian microelectronics research center imec showcased for the first time a quantum dot qubit device manufactured using High Nu...
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Chinese Research Team "Creates" High-Quality 200-Micron Single-Crystal Graphite, Thickness Over 3 Times the World Standard
2026-05-16
The Shanghai Artificial Intelligence Laboratory announced on May 13 that, relying on the overall deployment of the 2030 New Generation Artificial Intelligence National Science and Technology Major Pro...
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China's First 20K Solid-Phase Gene Chip for Brassica napus Released
2026-05-15
A joint team from Huazhong Agricultural University, Jiangxi Academy of Agricultural Sciences, and Suzhou Lasso Biotech Co., Ltd. has successfully launched the "Zhongxin You No. 1" solid-phase gene chi...
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New Breakthrough in Quantum Technology: Harvard-led International Team Observes Acoustic Purcell Effect in Diamond Nanostructures for the First Time
2026-05-15
A research team from the Harvard John A. Paulson School of Engineering and Applied Sciences, in collaboration with multiple international institutions, has successfully observed the acoustic Purcell e...
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