en.Wedoany.com Report on Mar 28th, Japanese chemical company Toray Industries recently announced that it will soon begin mass production of its STF-1000 photosensitive polyimide solution. This material aims to enhance microprocessing technology, and the company describes it as "the result of continuously driving breakthroughs in proprietary negative-type photosensitive technology."

STF-1000 can achieve a high aspect ratio patterning of 36 in films with thicknesses up to 500 micrometers. This high aspect ratio technology enables microstructures to have both narrow and high features, which is crucial for advanced electronics and microelectromechanical system applications.

Toray Industries has been sending samples to customers since last year for evaluation in areas such as electronic components and microelectromechanical systems. Microelectromechanical system technology utilizes semiconductor microprocessing methods to integrate micro-mechanical components, sensors, and actuators.

The company's innovation received the 2025 Japan Chemical Society Young Chemist Technology Development Award. This award recognizes Toray's success in achieving high aspect ratio patterning while maintaining the advantages of polyimide, such as heat and chemical resistance, mechanical strength, insulation properties, and UV durability.

Photolithography is the foundation for STF-1000, involving coating a photosensitive material onto a substrate and exposing it to form circuit patterns, thereby generating high-resolution graphics over large areas. This technology is vital for the manufacturing of semiconductors, liquid crystal displays, and sensors.

"The demand for miniaturization and dense integration of electronic components is driving the development of microelectromechanical system devices," Toray noted, emphasizing the growing need for photosensitive materials capable of high aspect ratio patterning in thick films. Traditional materials often suffer from delamination or cracking issues when exceeding 200 micrometers.

Toray addressed this challenge by improving the polymer design of its negative-type photosensitive material. The result is a polyimide material that suppresses pattern deformation and cracking even in thick films, achieving aspect ratios as high as 36 in films exceeding 200 micrometers.

This material supports various pattern types, including semiconductor vias and microelectromechanical system structures, and is also suitable for scintillator panels in X-ray non-destructive testing equipment. Future applications may encompass advanced semiconductors and microfluidic devices.

In 2025, Toray also developed STF-2000, a photosensitive polyimide free of per- and polyfluoroalkyl substances, focusing on electronic component and microfluidic applications.

Looking ahead, Toray plans to leverage its expertise in synthetic organic chemistry, polymer chemistry, biotechnology, and nanotechnology to drive the development of new materials. The company reaffirmed its commitment to providing innovative value and contributing to social progress.