en.Wedoany.com Reported - Intel is in ongoing discussions with Amazon and Google regarding advanced packaging services. The negotiations are in early stages, and no final agreement has been signed. According to reports from multiple media outlets citing several sources, the talks involve Intel's EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology. Amazon's self-developed Trainium AI training chip and Google's TPU (Tensor Processing Unit) are among the potential applications. Naga Chandrasekaran, head of Intel's foundry business, stated that packaging could reshape the artificial intelligence revolution in the next decade.
Intel's key advanced packaging technologies include EMIB for 2.5D integration and Foveros for 3D stacking. EMIB utilizes embedded silicon bridges to replace large silicon interposers, offering differentiated advantages in cost, yield, and production cycle time. According to a previous Intel announcement, Foveros capacity at the New Mexico packaging facility is expected to increase by 30%, and EMIB-T capacity investment is set to double to 150%. Currently, TSMC's CoWoS capacity is severely insufficient. Global CoWoS wafer demand for 2024 is 370,000 units, projected to climb to 1 million units by 2026, creating a market window for Intel's packaging technology.
If the negotiations are successful, Amazon and Google would become significant external customers for Intel's advanced packaging business. Intel previously secured an 18A process order for Microsoft's Maia AI accelerator. According to disclosures at Intel's 2025 Foundry Conference, the company plans to invest $90 billion over four years to strengthen capacity and technology R&D. Advanced packaging is evolving from a back-end semiconductor process into a core battleground for AI chip performance competition. The global advanced packaging market size is projected to grow from $50.38 billion in 2025 to $79.85 billion by 2032.
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