en.Wedoany.com Reported - Japan's Mitsui Kinzoku recently announced the successful development of a new copper sintering material that can be used for large-area bonding of heat dissipation components in power modules. Copper sintering materials play a critical role in the heat dissipation bonding of power modules, and Mitsui Kinzoku achieved this technological breakthrough through unique particle design and paste formulation techniques.

This copper sintering material can effectively suppress void formation under relatively low temperature and low pressure conditions of 230°C and 10 MPa. These processing conditions are milder compared to traditional sintering processes, helping to reduce energy consumption and equipment requirements during production. The low-temperature, low-pressure processing characteristics of the copper sintering material make it easier to integrate into existing power module production lines.

The new copper sintering material combines high thermal dissipation and high reliability while maintaining low cost. Mitsui Kinzoku stated that the paste formulation of this material has been optimized to maintain stable sintering quality in large-area bonding scenarios. The application range of the copper sintering material covers power modules in fields such as electric vehicles, industrial equipment, and renewable energy generation.

The heat dissipation performance of power modules directly affects their operating temperature and long-term stability. The introduction of this copper sintering material is expected to enhance the overall performance and energy efficiency of power modules. Mitsui Kinzoku plans to provide samples to power semiconductor manufacturers, promoting the verification and application of this material in mass production environments.

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