en.Wedoany.com Reported - TSMC and U.S. chip packaging and testing supplier Amkor Technology have signed a 10-year cooperation agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States.
Amkor stated in a press release that the partnership will support the construction of a more integrated semiconductor supply chain in Arizona. TSMC is making large-scale investments in chip manufacturing facilities in Arizona. Under the agreement, TSMC will procure advanced packaging and testing services from Amkor. Amkor noted that growing demand for artificial intelligence (AI), high-performance computing, and other advanced technologies has increased the importance of high-end chip assembly services. This collaboration is expected to create a more resilient U.S. domestic semiconductor supply chain and benefit customers across multiple industries.
Amkor CEO Kevin Engel said the agreement marks an important next step in the partnership, accelerating advanced semiconductor manufacturing in the U.S. and providing customers with a complete U.S. supply chain from advanced silicon manufacturing to tested and packaged devices. TSMC Senior Vice President and Deputy Co-Chief Operating Officer Kevin Zhang stated that the two companies have a long history of cooperation in advanced packaging technology and are pleased to sign the agreement, expressing confidence that their collaboration in the U.S. will succeed in enhancing capabilities to jointly serve customers.
The agreement is based on a memorandum of understanding signed by the two companies in October 2024, which plans to bring advanced packaging and testing capabilities to Arizona, including Chip-on-Wafer-on-Substrate (CoWoS) technology widely used in AI applications. Amkor is the world's second-largest chip packaging and testing company, trailing only ASE Technology Holding Co. TSMC's Arizona campus currently includes one factory already in mass production, a second factory scheduled to begin production in 2027, and a third factory that broke ground earlier this year. These three factories are the core of TSMC's initial $65 billion investment plan in Arizona. TSMC has also announced plans to invest an additional $100 billion in Arizona, including three new factories, two packaging facilities, and a research and development center.
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