AAC Technologies Joins Intel China Data Center Liquid Cooling Innovation Acceleration Program

en.Wedoany.com Reported - On September 23, Intel and AAC Technologies established a liquid cooling ecosystem partnership. The two parties held a signing ceremony at the 2026 Intel Technology Innovation and Industry Ecosystem Conference at the Suzhou International Expo Center. Chen Baoli, Vice President of Intel's Data Center Group and General Manager of Intel China, and Richard Mok, Executive Director of AAC Technologies Group, signed the cooperation agreement on behalf of both parties. This signing marks AAC Technologies' official entry into the Intel China Data Center Liquid Cooling Innovation Acceleration Program. The two parties will engage in in-depth cooperation in areas including data center liquid cooling technology R&D, product innovation, solution validation, and industry ecosystem development, jointly promoting the development of green, efficient, and reliable data center infrastructure for the AI era.

With the rapid development of artificial intelligence, high-performance computing, cloud services, and large model applications, data center computing power density continues to increase. Under conditions of higher power consumption, higher heat flux density, and more complex system deployment, traditional cooling methods are facing greater challenges. With more efficient thermal management capabilities and better energy efficiency performance, liquid cooling technology is gradually moving from cutting-edge exploration to large-scale deployment, becoming an important technology direction supporting next-generation AI infrastructure.

The Intel China Data Center Liquid Cooling Innovation Acceleration Program is committed to collaborating with industry chain partners on liquid cooling key technologies, platform adaptation, system-level solutions, validation methods, and ecosystem collaboration, helping industry partners accelerate capability building and solution deployment. The program emphasizes open collaboration and long-term ecosystem co-building, promoting more efficient coordination across chip platforms, system architecture, liquid cooling components, complete machine integration, and data center infrastructure, better aligning with end-customer needs.

As a globally renowned precision manufacturing enterprise, AAC Technologies has deep expertise in microstructure processing, thermal management, VC vapor chamber technology, cold plate manufacturing, automated production, and large-scale delivery. In recent years, AAC Technologies has actively expanded into data center liquid cooling-related businesses, continuously investing in cold plates, UQD / QD quick connectors, manifolds, VC-enhanced heat dissipation, CDU, complete machine system-level liquid cooling solutions, and validation capability building. The two parties conducted multiple rounds of in-depth exchanges on liquid cooling technology trends, manufacturing capabilities, product roadmaps, validation systems, and system-level integration directions in the early stage, laying a solid foundation for this cooperation.

In this cooperation, the two parties plan to combine Intel's experience in data center platforms, server architecture, liquid cooling reference designs, ecosystem validation, and industry collaboration with AAC Technologies' advantages in precision manufacturing, thermal management product development, engineering implementation, and large-scale production to jointly advance liquid cooling technology cooperation for high-density servers and rack-level architectures. Cooperation directions will include but not be limited to CPU cold plates, memory liquid cooling, SSD liquid cooling, UQD / QD connections, manifolds, CDU, complete machine node-level liquid cooling architecture, rack-level liquid cooling solutions, and related validation capability building.

This signing is not only an important milestone in the cooperative relationship between the two parties, but also reflects the trend of upstream and downstream industry chain players jointly promoting the maturation of the liquid cooling ecosystem. As AI infrastructure moves from single-point innovation to large-scale deployment, customers need not only a single component or a single technology, but complete solutions supported by systematic design, engineering validation, and ecosystem collaboration. The cooperation between Intel and AAC Technologies will help further connect platform technology, product development, manufacturing capabilities, and market demand, accelerating liquid cooling solutions from sample development and technical validation to industrial application.

In the future, the two parties will continue to advance technical exchanges, joint validation, capability building, and ecosystem collaboration around cooperative projects, exploring more innovation opportunities for AI data centers and high-performance computing scenarios on the basis of open cooperation. Intel looks forward to growing together with AAC Technologies, promoting the enhancement of liquid cooling industry chain capabilities, and working with more ecosystem partners to build a greener, more efficient, and more open next-generation data center infrastructure ecosystem.