Mouser Electronics in the US Ships Atmosic ATM34e Chip Supporting Bluetooth 6.0 and Energy Harvesting
Mouser Electronics, Inc. has begun shipping the ATM34/e system-on-chip (SoC) from Atmosic Technologi...
GSMA to Establish Global 6G Alliance by Year-End, Involving China, US, Japan, South Korea, and Others
The Global System for Mobile Communications Association (GSMA) plans to form a global alliance by th...
Xiaomi and Leica Launch Leitzphone with 13 Leica Looks
The Leica Leitzphone powered by Xiaomi (hereinafter referred to as the Leitzphone), released alongsi...
China Mobile 2026-2027 5G Main Equipment Procurement: Five Companies Including Huawei and ZTE Win Bids
China Mobile has announced the candidates for its 2026-2027 5G wireless main equipment centralized p...
Belgium's imec Unveils World's First 802.15.4ab UWB Receiver, Quadrupling Ranging Performance
Imec, the Belgian microelectronics research center, has unveiled what it claims is the world's first...
Lintes Q1 Revenue Up 17.2% in Taiwan, China, Accelerating AI Connectivity Capacity Expansion
High-speed interconnect solution provider Lintes Technology (TWSE: 6715) reported a 17.2% year-over-...
Russia's Rexant Adjusts Product Strategy, Shifting to Integrated Copper and Fiber Optic Solutions
Russian cable, electrical, and lighting product manufacturer ООО "СДС" (OOO SDS, TM Rexant) has adju...
China's HKC Establishes Semiconductor R&D Company to Extend Optoelectronics Layout
On June 10, Chengdu Huixin Semiconductor R&D Co., Ltd. was established, with legal representative Lu...
Qorvo Launches Compact X-Band Front-End Module with 10W Power and 42% Efficiency
Qorvo has introduced an X-band radar front-end module that enables defense system designers to achie...
South Korea's SK Hynix Plans to Triple Wafer Production Capacity
On June 11, Chey Tae-won, Chairman of South Korea's SK Group, stated that its memory chip subsidiary...
South Korea's SK Hynix Enters Mass Production Preparation Phase for 375-Layer 3D NAND
June 11 news, South Korean memory chip company SK Hynix has completed mass production verification o...
US CTIA Releases Wireless Device Grading Standard Version 5.1, Enhancing Transparency for Second-Hand Devices
The US wireless communications and internet association (CTIA) recently announced the release of CTI...
Swiss Littlebit Launches New Yealink Meeting Board Products
Swiss distributor Littlebit Technology has launched two new models from Chinese manufacturer Yealink...
Apple's iPhone 18 Pro Expected to Replace Qualcomm with In-House C2 Modem
Apple is expected to use its self-developed C2 modem chip in the iPhone 18 Pro, thereby replacing th...
Shokz Chinese factory produces 1,400 pairs of open-ear headphones daily
Shokz builds its competitiveness through rigorous engineering testing and manufacturing processes. T...
Hirose Electric Launches Automotive USB-C Connector Compliant with USCAR Standards
Hirose Electric has introduced the AU1 series shielded USB Type-C connector, which complies with USC...
Haivision Reports Q2 Fiscal 2026 Revenue of $32.5 Million
Haivision Systems Inc. announced its second quarter results for the period ending April 30, 2026, wi...
China's iFlytek Joins Hands with Wanxin Optical to Build AI Glasses Ecosystem
On June 10, China's iFlytek Co., Ltd. signed a strategic cooperation agreement on AI glasses with Wa...
FICER from Taiwan, China Showcases Optical Modules and OTN DWDM Systems
On June 10, FICER Technology, a Taiwan, China-based manufacturer of fiber optic products and transmi...
Swedish Sivers Semiconductors Secures $8.2 Million Ka-Band Chip Order
Sivers Semiconductors has received an $8.2 million production order to supply next-generation multi-...
Ireland's MBRYONICS Launches World's First 800G Coherent Transceiver for Space
Global satellite optical communications company MBRYONICS today announced the launch of STARLIGHT, t...
Russian fiber optic cable manufacturer Inkab announces IPO
Inkab Holding Public Joint-Stock Company (PJSC "Inkab Holding") has announced plans to conduct an in...
Emerson Introduces New PXI Vector Signal Transceivers to Expand RF Test Applications
Emerson has added two instruments to its NI PXI Vector Signal Transceiver (VST) product family, aimi...
Australia's Morse Micro Launches 28.5 dBm Wi-Fi HaLow Module for the US and Canada
Morse Micro, the world's leading supplier of Wi-Fi HaLow silicon, has announced the launch of the hi...
India's Dixon and Taiwan's Gemtek Jointly Produce SFP and Optical Components
Indian domestic company Dixon Technologies and its subsidiary Dixon Electroconnect have signed a bin...
Sweden's Bluetest Appoints Fastech as Distributor in India for OTA Testing Systems
Bluetest has appointed Fastech Telecommunications (India) Pvt. Ltd. as its official distributor in I...
Keysight Adds GlobalFoundries Silicon Photonics Support to ADS
Keysight Technologies has announced support for GlobalFoundries' silicon photonics process technolog...
China's Hengtong Optic-Electric Q1 Performance Surges, Market Cap Exceeds 225.5 Billion Yuan
Hengtong Group achieved significant growth in revenue and net profit in the first quarter of 2026, w...
China Duomi Technology to Showcase Multiple BeiDou Positioning Terminals at 2026 Shenzhen IoT Expo
The IOTE 2026 25th International Internet of Things Exhibition · Shenzhen will be held from August 2...
Lola GEN from the US Launches Global Emergency Network, Debuts First Terminal
Lola Wireless GEN has announced the official public launch of its global emergency network, Lola GEN...