en.Wedoany.com Reported - High-speed interconnect solution provider Lintes Technology (TWSE: 6715) reported a 17.2% year-over-year increase in first-quarter 2026 revenue and forecasts strong growth for the full year. Driven by AI demand, the company is upgrading its production lines to flexible and replicable automated systems to meet global customers' mass production requirements.
Lintes Technology CEO Max Lo stated that many people know the company due to its long-term collaboration with Intel, but optical communication has always been one of the company's core technological foundations. Since 2025, the company has increased R&D investment, focusing on developing next-generation products for AI server demands, including 6.4T co-packaged copper cable (CPC) and co-packaged optics (CPO) sockets (32TX+32RX). Max Lo noted that combining high-barrier R&D with modular, replicable automated manufacturing helps improve production efficiency while maintaining product quality, preparing for AI infrastructure deployment.
At Computex Taipei 2026, Lintes showcased a connectivity portfolio covering from edge AI devices to hyperscale AI clusters, including: AEC, DAC, CPC, and CPO solutions for hyperscale AI networks; MCIO, Multi-Trak, and SlimSAS solutions for high-density AI server interconnects; and Thunderbolt and USB connectivity solutions for edge and device AI applications.
To meet global mass production demands, the company made a strategic investment in Gen Precision in 2020 to strengthen its capabilities in optical communication manufacturing, automation, and testing. With over 30 years of precision machining experience, Gen Precision provides manufacturing accuracy up to 0.1 μm for passive optical components. Leveraging its expertise in automated production line construction, automatic optical coupling and testing, and smart manufacturing system integration, Lintes will accelerate the expansion of high-bandwidth interconnect capacity globally to achieve mass production.
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