Category: Communication Equipment Manufacturing Engineering

NVIDIA Plans N2X and N3X Successors to N1X, Shifting AI PC Platform from Single Chip to Full-Stack Ecosystem

On June 2, NVIDIA CEO Jensen Huang stated at a media briefing in Taipei that N1X is a long-term plat...

2026-06-02

Motorola Launches moto g47 Enterprise Phone in Brazil

Motorola has launched the moto g47 for business in the Brazilian market. Designed specifically for e...

2026-06-02

Intel Launches E835 Ethernet Product with 47% Lower Power Consumption than Nvidia

Intel expanded its server and Ethernet network product portfolio at the Computex exhibition in Taipe...

2026-06-02

Identiv Launches Low-Energy Bluetooth Inlay Tags with Wiliot Technology

Identiv has launched a new series of low-energy Bluetooth (BLE) inlays and tags featuring Wiliot Gen...

2026-06-02

Dell Launches PowerStore Elite with 5.8PB Capacity

Dell has launched its next-generation all-flash storage platform, PowerStore Elite, which delivers u...

2026-06-02

VIAVI Launches µPNT GDO-1000 GNSS Disciplined Oscillator

VIAVI Solutions Inc. (NASDAQ: VIAV) has launched the µPNT GDO-1000, a new GNSS disciplined oscillato...

2026-06-02

India's Odisha Introduces Intel and 3DGS, $3.3 Billion Glass Substrate Project Fills Advanced Packaging Chain Gap

India's Odisha recently signed a memorandum of understanding with US-based Intel and US-based 3D Gla...

2026-06-01

US TP-Link to Launch Archer 8 in October, Home Routers Enter the Wi-Fi 8 Cycle Ahead of Schedule

Recently, US TP-Link Systems announced Archer 8, the company's first router platform based on the em...

2026-05-30

Ericsson Decides to Keep Headquarters in Sweden, Moving to Hagastaden in 2028

Ericsson has announced that it will relocate its headquarters in the Stockholm area from Kista to Ha...

2026-05-28

Polish Grinn Edge AI Hardware Lands on DigiKey Platform

On May 25, Grinn, a Polish IoT and embedded systems company, announced that its hardware portfolio i...

2026-05-26

Huawei Proposes the Tao (τ) Law: Exploring a New Path for Chip Evolution Through Time Scaling

On May 25, at the IEEE International Symposium on Circuits and Systems (ISCAS) 2026, He Tingbo, Boar...

2026-05-26

U.S.-based pSemi to Showcase RF Switch and Broadband Technologies at IMS 2026

On May 25, pSemi announced it will showcase its RF technology and solutions for mobile and wired bro...

2026-05-26

SK Hynix of South Korea Introduces iHBM Thermal Solution for Next-Generation AI Memory

On May 25, SK hynix of South Korea announced the launch of its iHBM thermal solution, which embeds i...

2026-05-26

Princeton University's Qumus System Autonomously Manufactures Graphene and Fabricates Transistors

Princeton University and several collaborating institutions recently published a research achievemen...

2026-05-26

China's Lenovo Group hits record annual revenue of US$83.1 billion, Yang Yuanqing expresses strong confidence in reaching US$100 billion target within two years

Lenovo Group announced its full-year and fourth quarter results for the 2025/26 fiscal year on May 2...

2026-05-22

Georgia Tech's New NAND Flash Memory Boosts Radiation Tolerance by 30 Times

Researchers at the Georgia Institute of Technology have developed a new type of NAND flash memory th...

2026-05-22

Nvidia CFO Confirms Rubin Chip Shipments in Second Half of Year, Reaffirms Confidence in Trillion-Dollar Revenue Target

Nvidia announced its first-quarter fiscal earnings after the market closed on May 20 local time. Dur...

2026-05-21

AMD Announces Mass Production of 6th Gen EPYC "Venice" Processors on TSMC 2nm Process, 256 Cores Targeting AI Infrastructure

Advanced Micro Devices (AMD) officially announced on May 21 that its 6th generation AMD EPYC process...

2026-05-21

China's Rongxin Zhiyuan and Intretech Sign Strategic Cooperation Agreement on Computing Power Servers

Rongxin Zhiyuan and Intretech officially signed a strategic cooperation agreement on computing power...

2026-05-21

China's Firefly RISC-V Rack Server Launched: 384-Core RISC-V Chip

Chinese brand Firefly has officially launched a 42U rack-mount RISC-V server, the CSC2-N48SPK3, on i...

2026-05-21

Ben Chuan Intelligent in China Starts Small-Batch Supply of 800G Optical Module PCBs, with 6 Customers Completing Prototyping

Ben Chuan Intelligent disclosed in its investor relations activity record announcement on May 19 tha...

2026-05-20

China's Lenovo Moto Razr Fold Large Foldable Phone Released, Featuring Tianxi AI 4.0 and Snapdragon 8 Gen5 Chip

On the evening of May 19, Lenovo officially launched its first horizontal large foldable screen phon...

2026-05-20

China's SMIC, Huahong Group, and others jointly establish Shanghai Electronic Materials International Supply Chain Center with a registered capital of 200 million yuan

Core enterprises in China's semiconductor industry chain are accelerating their extension into upstr...

2026-05-20

Mirantis Launches AI Governance and Inference Tools to Facilitate GPU Cloud Production Deployment

Cloud-native infrastructure platform provider Mirantis officially announced on May 14 in Campbell, C...

2026-05-20

FCC Documents Reveal Amazon Leo Satellite Internet Wi-Fi Router, Equipped with Qualcomm Chips and Supporting Smart Home Protocols

The U.S. Federal Communications Commission (FCC) officially made public the exterior and internal st...

2026-05-20

China's Click Technology Invests 370 Million Mexican Pesos to Build Electronics Manufacturing Plant in Torreón, Coahuila

Shenzhen Click Technology Co., Ltd. announced it will invest approximately 370 million Mexican pesos...

2026-05-19

China's Goworld (Jiangsu) $150 Million Optical Module and High-Density Interconnect Board R&D and Manufacturing Base Settles in Xishan, Wuxi

On May 18, China Goworld (Jiangsu) Electronic Technology Co., Ltd., a subsidiary of Singapore's Gowo...

2026-05-19

Great Wall Motor's HYCET Automotive Increases Investment by 1 Billion Yuan to Build Intelligent Driving Domain Controller Production Base in Changshu, with Annual Output Value of 2 Billion Yuan After Reaching Full Capacity

HYCET Automotive Technology Group, a subsidiary of Great Wall Motor Group, officially signed an agre...

2026-05-19

Ren Hongbin, Chairman of the China Council for the Promotion of International Trade (CCPIT), Meets with AMD's Lisa Su; Computing Power Cooperation and APEC Business Activities Take Center Stage

Ren Hongbin, Chairman of the China Council for the Promotion of International Trade (CCPIT), met wit...

2026-05-19

China's SoftStone Computer Wins Bid for China Mobile PC Server Centralized Procurement Project, Valued at Over 1.753 Billion Yuan

SoftStone Power announced on May 19 that its subsidiary, SoftStone Computer, successfully won the bi...

2026-05-19
Previous Next Jump to
Confirm