en.Wedoany.com Reported - Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding to explore strategic collaboration on silicon carbide (SiC) power modules for automotive traction inverter applications. The two parties plan to evaluate how joint solutions can deliver high-performance, scalable solutions for next-generation electric vehicles, combining Nexperia's expertise in SiC semiconductor technology with Semikron Danfoss's leading capabilities in power module packaging and integration.

Silicon carbide technology plays a crucial role in enhancing the efficiency, power density, and performance of electric drive systems. The two companies will integrate complementary capabilities across the entire value chain from chip to module, advancing solutions optimized for the stringent requirements of automotive applications. As part of the collaboration, both companies will also explore joint engineering approaches, including early integration and co-design, to fully unlock the performance potential of SiC systems.

Carsten Götte, Senior Vice President of the Automotive Power Module Division at Semikron Danfoss, stated that by combining Nexperia's advanced semiconductor technology with module expertise, they see significant potential in this strong synergy and look forward to exploring how this collaboration can create greater value for customers in the rapidly evolving electric vehicle market.

Edoardo Merli, Senior Vice President and General Manager of the Wide Bandgap, IGBT, and Module Division at Nexperia, emphasized that strong partnerships are essential to unlocking the full potential of wide bandgap technologies, including SiC and GaN. With sustained R&D investment and a focus on early collaboration, they actively drive alignment between semiconductors and system requirements from the outset, and are excited to explore how cooperation with Semikron Danfoss can advance module products.

Both companies share deep European roots and extensive industry experience, laying a solid foundation for exploring future collaboration opportunities in automotive power electronics.

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