en.Wedoany.com Reported - Tektronix launches broadband shunt resistors and THDP0400 high-voltage probes, supporting precision low-current analysis and high-voltage testing in advanced power electronics design.

Wolfspeed enters AI data centers, establishing a new Silicon Valley solutions team and conducting industry recruitment, aiming to accelerate the adoption of silicon carbide-based power solutions in high-density AI and hyperscale data centers.

Vishay introduces a 1.5 kV high-voltage IHDV inductor, a compact device integrating 1.5 kV isolation, low-noise filtering, and soft saturation characteristics, with an operating temperature up to 180 °C.

ROHM releases the AG16xFNxx series 80V MOSFETs, specifically designed for automotive 48V architectures, offering compact packaging, high current capability, and AEC-Q101 certification.

Silicon-based thermal interface materials (thermal greases, gels, and adhesives) are being used to address thermal management challenges of IGBT-7 power modules in electric vehicles and renewable energy systems.

A PCIM workshop on data center power distribution evolution reveals the inevitable trend toward transitioning to 800V DC, with hyperscalers actively advancing, but safety standards and ecosystem readiness lagging behind.

Designs from multiple suppliers demonstrate how the 3L-FC-BTP (three-level flying capacitor bridgeless totem-pole PFC) topology achieves 80 Plus Titanium efficiency in AI servers.

Fraunhofer IZM showcases a silicon carbide (SiC) inverter module based on active metal brazing (AMB) chip embedding technology, achieving a power density of 500 kW/l.

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