en.Wedoany.com Reported - On July 2, local time, ams OSRAM announced that Ashkan Seyedi, a former NVIDIA executive in optical interconnect technology, has joined the company as Vice President and General Manager of the Optical Interconnect Business Line. He will be responsible for driving the development of optical interconnect technology for next-generation AI data centers, focusing on digital photonics, micro emitters, and high-speed, low-power data transmission.
Seyedi previously worked on optical interconnect technology R&D at NVIDIA, targeting high-speed communication for AI clusters and data centers. As AI server clusters continue to scale, data flows at high speeds between GPUs, AI accelerators, switches, storage devices, and different racks. Traditional electrical interconnects face increasing pressure in terms of transmission distance, power consumption, heat dissipation, and bandwidth density. Optical interconnects, which transmit data via optical signals, enable intra-rack, inter-rack, and even data center-level transmission with lower loss and higher bandwidth. By bringing in an executive with an NVIDIA optical interconnect background, ams OSRAM aims to more directly embed its optical components, emitters, and photonic technology capabilities into the AI data center supply chain.
The digital photonics strategy is the core technological thread behind this appointment. Seyedi stated on social media that, with the rapid expansion of AI data centers, the company will continue to advance its digital photonics strategy, accelerating the development of core optical components such as micro emitters. Micro emitters convert electrical signals into optical signals and are fundamental components in high-speed optical interconnect links. To achieve higher throughput, lower latency, and lower energy consumption in AI data centers, optical modules, optical engines, lasers, detectors, driver chips, packaging substrates, and thermal management structures must work in synergy. If the performance improvement of individual components cannot adapt to system-level packaging, network switching, and server architectures, their value is difficult to realize in large-scale clusters.
With a long-standing focus on optoelectronic components, sensing, and light source technologies, ams OSRAM's entry into the AI data center optical interconnect market will extend its business boundaries from traditional optoelectronic components to high-performance computing infrastructure. Data center customers are concerned not only with the specifications of individual optical components but also with component size, power consumption, reliability, batch consistency, packaging compatibility, and long-term supply capability. As demand for 800G, 1.6T, and even higher-speed interconnects grows, optical component manufacturers must simultaneously improve materials, packaging, testing, and manufacturing yields. Seyedi's experience in optical interconnect R&D for NVIDIA's AI clusters will help the company better align with the real needs of AI server, switching network, and high-performance computing customers.
This appointment is not a routine management adjustment but an organizational move by ams OSRAM to strengthen its AI data center optical interconnect business. Subsequent progress will focus on micro emitter R&D, digital photonics product roadmaps, customer validation, mass production capabilities, and collaboration with AI data center equipment vendors. Optical interconnects are becoming a critical link in AI infrastructure, shifting competition from chip performance to system-level bandwidth. By bringing in talent with an NVIDIA technical background, ams OSRAM aims to secure a higher-value position in this chain.
