en.Wedoany.com Reported - Haite Xinke's "Starry Sky Semiconductor Thermal Management Series Product Project" completed filing in June 2026, with approval for an additional 42.45 mu of new construction land. The project is scheduled to commence construction in September 2026, with a total investment of 1 billion yuan and a land area of 42.45 mu. It will include the construction of three factory buildings, one employee dormitory, and one ancillary building. Upon completion, it will become an intelligent manufacturing industrial base integrating new material research and development, precision forging, precision machining, welding, surface treatment, system integration, and comprehensive support.
According to Haite Xinke, the new project will focus on the research, development, and manufacturing of high-end heat sink materials and products, as well as microchannel liquid cooling plates. The planned production lines include multiple lines for semiconductor core high-end equipment microchannel molybdenum cold plates, diamond copper/diamond aluminum high-end heat sinks, AI computing center liquid cooling plates, optical communication optical module tungsten copper heat sinks, and automotive-grade power module water cooling boxes, along with supporting surface treatment lines. To meet the high precision and high reliability requirements of the project, the company will introduce internationally advanced ultra-precision machining and inspection equipment such as CNC slow wire electrical discharge machines, ultra-precision CNC machining centers, coordinate grinding machines, coordinate measuring machines, and white light interferometers. Additionally, it will be equipped with domestic high-end material manufacturing, processing, and inspection equipment including vacuum sintering, pressure sintering, laser welding, vacuum brazing, diffusion welding, helium mass spectrometer leak detectors, and surface treatment systems, enabling independent construction and control of the entire product line process to ensure product consistency, reliability, and delivery stability.
The new project targets heat dissipation needs for chips and power modules in fields such as semiconductor core high-end equipment, AI computing centers, optical communication optical modules, new energy power modules, and 5G/6G communication. Upon full production, it will achieve an annual production capacity of 15 million semiconductor thermal management series products. At that time, Haite Xinke will establish a scaled product and capacity matrix covering mainstream semiconductor thermal management application scenarios, including semiconductor core high-end equipment microchannel molybdenum cold plates, diamond copper/diamond aluminum high-end heat sinks, AI computing center liquid cooling plates, optical communication optical module tungsten copper heat sinks, and automotive-grade power module water cooling boxes. The project is expected to generate an annual output value of over 2 billion yuan upon full production.
Haite Xinke stated that the company focuses on the semiconductor thermal management field, winning market trust through technical strength, manufacturing capability, product quality, and full-cycle premium services. The implementation of the new project will further enhance brand influence and the supply capacity of high-end thermal management products to meet the higher requirements for thermal management driven by the continuous increase in chip power in industries such as semiconductor core high-end equipment, AI computing centers, optical communication, new energy, and 5G/6G communication. In the future, Haite Xinke plans to continue increasing R&D investment, leveraging independent innovation and scaled production capacity to provide higher cost-performance semiconductor thermal management series products and solutions, promoting the domestic substitution of more heat sinks and liquid cooling products.
