Union Memory Technology Plans Private Placement of Up to 2.062 Billion Yuan for R&D of PCIe Gen6/Gen7 Controller Chips
2026-04-10 10:40
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en.Wedoany.com Reported - On April 9, Union Memory Technology disclosed plans for a private placement to raise up to 2.062 billion yuan. According to the announcement, the raised funds will be used for the R&D project of a new generation of data storage controller chip series products for data centers and intelligent terminals, as well as to supplement working capital.

The announcement disclosed that the total investment for the chip R&D project is 2.545 billion yuan, with 2.062 billion yuan to be raised through this placement, and a construction period of 5 years. The project will focus on technological breakthroughs for enterprise-class PCIe Gen6 SSD controller chips, enterprise-class PCIe Gen7 SSD controller chips, consumer-grade PCIe Gen6 SSD controller chips, and UFS 5.0 embedded storage controller chips. It will prioritize overcoming key technical challenges such as ultra-high-speed interface design, high-efficiency flash memory management, and low-power optimization.

Union Memory Technology also released its 2025 annual report on the same day. The company achieved annual operating revenue of 1.327 billion yuan, a year-on-year increase of 13.06%; net profit attributable to the parent company was 142 million yuan, up 20.41% year-on-year; operating cash flow was 155 million yuan. The performance growth was mainly driven by the recovery in the storage industry's prosperity and continuous breakthroughs in the PC-OEM market, leading to significant shipment growth for PCIe 3.0, PCIe 4.0, and enterprise-class SATA controller chip products. The company plans to distribute a cash dividend of 0.5 yuan per 10 shares (including tax), totaling 23 million yuan.

Union Memory Technology's SSD controller chips account for 25% of global shipments, ranking second globally among independent third-party controller manufacturers. Currently, its enterprise-class PCIe 5.0 SSD controller chip has entered mass production testing, the UFS 3.1 controller chip has entered mass production, and a new generation of in-vehicle perception signal processing chip has passed the AEC-Q100 automotive-grade certification. The company's R&D team exceeds 600 people, and it added 76 new invention patents in 2025.

The announcement points out that the global semiconductor industry is undergoing a paradigm shift driven by generative artificial intelligence. The combined capital expenditure of Microsoft, Google, Amazon, and Meta in 2025 was approximately $400 billion, and it is expected to grow by 25% to about $500 billion in 2026. The storage capacity demand of a single AI server far exceeds that of traditional servers, leading to an exponential increase in demand for high-performance storage controller chips on the data center side. This private placement by Union Memory Technology aims to precisely meet the high-end demands of data centers and intelligent terminals for storage performance, bandwidth, and reliability, improve its high-end product portfolio, and strengthen its independent and controllable core technology capabilities.

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