en.Wedoany.com Reported - Toray Industries, Inc. of Japan has announced the launch of a new photosensitive polyimide sealing material specifically designed for next-generation semiconductor applications such as Micro-Electro-Mechanical Systems (MEMS). Based on the company's SEMICOFINE and PHOTONEECE platforms, this material enables fine pattern formation and bonding through photolithography technology and can reliably seal hollow structures within MEMS.
Traditionally, gold has been used for MEMS sealing due to its durability and heat resistance, but its high cost and limited design flexibility have driven the industry to seek resin alternatives. Toray's new material addresses the issues of weak heat resistance and structural instability under temperature fluctuations seen in traditional resins like epoxy. By optimizing the polyimide molecular structure and photosensitive properties, this material combines high heat resistance with low residual stress, reducing warpage and enhancing long-term reliability.
Furthermore, the new material offers high mechanical strength, supports finer bonding wires and higher device density, and aligns with the trend of electronic product miniaturization. It is free of PFAS and NMP, meeting global demand for environmentally friendly materials. Toray plans to showcase this achievement at the International Conference on Electronics Packaging and Hybrid Bonding from April 14 to 18, 2026, accelerating the transition from lab to market.
The company aims to expand its semiconductor materials portfolio through this development, providing prototypes and sample distribution to MEMS customers. Certification is targeted for 2027, with mass production planned to commence in 2029. Leveraging its expertise in chemistry, biotechnology, and nanotechnology, Toray stated it will continue to advance innovation in advanced materials to support technological progress.
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