en.Wedoany.com Reported - Umicore Metal Deposition Solutions (Umicore MDS, located in Schwäbisch Gmünd, Germany) recently introduced a new high-performance hard gold plating electrolyte, Auruna 8000, as an extension of its gold-iron product portfolio. This product is specifically designed for high-speed systems and brush plating applications, aiming to provide high deposition rates and superior coating characteristics while reducing operational risks.
The electrolyte can handle high current densities, with deposition rates reaching up to 8 µm/min. The resulting hard gold layer has a hardness of approximately 130 HV, featuring low porosity and wear resistance, with a contact transfer resistance of less than 5 mΩ (test force 50 cN). It complies with the ASTM B 488 01: Type I, Code C standard and is suitable for electrical contact surfaces and connectors requiring low resistance and high reliability.
Auruna 8000 is free of cobalt and nickel, which helps reduce health risks in production and lowers regulatory costs for businesses. Umicore Metal Deposition Solutions stated that its existing Auruna 8100 (gold-cobalt) and Auruna 8400 (gold-nickel) electrolytes remain available for normal supply, and the new process operates similarly, facilitating customer transition.
Benjamin Wieser, Manager of the Technical Application Precious Metals Department at Umicore Metal Deposition Solutions, said: "Even companies that previously used competing products on high-speed production lines can now produce more sustainably without fundamentally altering their existing infrastructure." Furthermore, Auruna 8000 supports the use of Auruna Inhibitor 2, which can reduce gold consumption by up to 15%.
With the launch of Auruna 8000, Umicore's gold-iron product line now covers common plating processes such as rack plating, barrel plating, and reel-to-reel plating, enhancing its competitiveness in the hard gold plating market.
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