en.Wedoany.com Reported - Embedded and edge computing technology provider congatec officially launched the conga-TC300 computer module on April 16, 2026, in San Diego, California, USA. This module adopts the COM Express Compact form factor and is equipped with an Intel Core series 3 processor (codename Wildcat Lake), marking the first introduction of a dedicated AI accelerator in a low-power, entry-level x86-based embedded computing platform. The conga-TC300 targets the cost-sensitive edge AI application market, covering scenarios such as robotics, industrial automation, medical technology, transportation, smart cities, and retail terminals.
The Intel Core series 3 processor is based on Intel's 18A process technology, featuring two performance cores and four low-power efficiency cores, with a base Thermal Design Power (TDP) of 15W and a scalable range from 12W to 28W. This module integrates a Neural Processing Unit (NPU), delivering up to 18 TOPS of computing power; it is equipped with up to two Xe3 graphics cores for General-Purpose Graphics Processing Unit (GPGPU) acceleration of AI tasks, also contributing up to 18 TOPS; the processor itself provides up to 5 TOPS, enabling a total of 41 TOPS of heterogeneous AI performance. The conga-TC300 supports up to 64GB of DDR memory with speeds up to 6400 MT/s and optional In-Band ECC (Error-Correcting Code) functionality; onboard storage options include up to 512GB of Universal Flash Storage (UFS) 3.1 specification.
In a press release, Jürgen Jungbauer, Senior Product Line Manager at congatec, stated that the conga-TC300 opens a reliable upgrade path for low-power, lightweight AI applications, with the product promising ten years of availability. Original Equipment Manufacturers (OEMs) can configure AI features such as local voice or gesture control, AI-assisted object recognition, and Large Language Model (LLM)-based conversational interaction for devices like Autonomous Guided Vehicles (AGVs), Autonomous Mobile Robots (AMRs), intelligent machine control, Human-Machine Interfaces (HMIs), patient data monitoring systems, surveillance terminals, and check-in/check-out terminals.
The module provides a 2.5 Gigabit Ethernet interface, with optional Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) capabilities. Input/output resources include up to two Digital Display Interfaces (DDI), one Low-Voltage Differential Signaling (LVDS) or Embedded DisplayPort (eDP) interface, two USB4 ports, four USB 3.2 ports, four USB 2.0 ports, two Serial ATA (SATA) ports, two Universal Asynchronous Receiver/Transmitters (UARTs), General-Purpose Input/Output (GPIO), General-Purpose SPI, Enhanced Serial Peripheral Interface (eSPI), System Management Bus (SMBus), High Definition Audio (HDA), and Inter-Integrated Circuit (I²C) bus. The module integrates a Trusted Platform Module (TPM) 2.0 and supports Windows 11, Windows 11 IoT Enterprise, and Linux operating systems.
As a member of the application-ready aReady.COM series, the conga-TC300 comes pre-configured with authorized ctrlX OS, Ubuntu Pro, and KontronOS operating systems. The aReady.VT option integrates the conga-zones hypervisor and virtualization technology, supporting the consolidation of multiple workloads such as real-time control, HMI, AI inference, and IoT gateway onto a single module. The aReady.IOT software building blocks provide Industrial IoT (IIoT) connectivity capabilities, and the conga-connect function supports data exchange, remote maintenance, management of the module, carrier board, and peripherals, as well as on-demand cloud connectivity. congatec simultaneously provides supporting services including evaluation carrier boards, application carrier boards, custom thermal solutions, design services, and high-speed signal integrity measurements. The aReady.YOURS service can deliver turnkey embedded computing platforms and advanced thermal solutions.
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