en.Wedoany.com Reported - The European Institute of Printed Circuits (EIPC) Summer Conference will be held in Vilnius, the capital of Lithuania, from June 9 to 10, 2026. The theme of this year's conference is "AI and Robotics Integrated Manufacturing." The venue is set at the AC Hotel Vilnius, and the conference will include a two-day technical forum and a factory site visit. Founded in 1968, the EIPC is a major technical exchange platform for the European printed circuit board industry. The Summer and Winter Conferences are held alternately in various European cities each year. The 2026 Winter Conference was already held in Aix-en-Provence, France, in February.
The first day's agenda focuses on the global electronics industry's business outlook and advanced manufacturing technologies. Jon Custer, Principal of Custer Consulting, will deliver the opening keynote address titled "Business Outlook: Global Electronics Industry." Dieter Weiss, Founder of the data analysis firm in4ma, will present an analysis report on "The Current State of the European EMS and PCB Industry." According to the "European EMS Industry Annual Survey" released by the Global Electronics Association in April 2026, European EMS market revenue in 2025 decreased by 2.9% year-on-year. Alison James, Senior Director of European Government Relations at the Global Electronics Association, will give a speech on "EU Advocacy for Strengthening the European Defense Ecosystem." A research report previously published by the association indicates that by 2035, electronic systems will account for approximately 25% of the total value of defense equipment.
The topics of automation and AI-driven manufacturing form the core agenda for the afternoon of the first day. Sultan Saidov of Alpha Machines will introduce PCB manufacturing automation and its impacts. Aurelijus Beleckis of the Lithuanian robotics company Elinta Robotics will analyze global trends in automation and AI for the PCB industry. Reshmaa Selvakumar of Elsyca will discuss the application of digital twin technology in electroplating processes. Dr. G. Hoffmann of LexaTexer-Enterprise AI will use the Dyconex AG factory as a case study to demonstrate AI-driven automated auditing practices in PCB manufacturing. Thin-film sputtering and precision imaging technologies are also on the agenda. Lukas Dinkelmann of Dyconex will report on the influence of sputtering conditions on titanium thin-film resistance. Dennis Pusch of the German company Schmoll Maschinen will analyze the techno-economic trade-offs of UV light source technology in PCB direct imaging. During the conference, participants will be organized to visit the TLT PCB factory, followed by a networking dinner.
The agenda for the second day revolves around high-speed AI server PCB processes and cutting-edge materials. Romina Adam of Umicore will present research on nickel-free final surface finishes. The European Space Agency and IMEC (the Belgian microelectronics research center) will jointly discuss stacked microvia reliability issues and the latest high-density interconnect technologies for space applications. Ventec will introduce its new adhesive film products. The University of Portsmouth will present a paper on recyclable PCB substrates. A panel discussion on the theme of AI and Robotics will be jointly hosted by four companies: Alpha Machines, Elinta Robotics, Elsyca, and LexaTexer-Enterprise AI. EIPC Chairman Rico Schlüter was elected in January 2026, having previously served as EIPC Vice Chairman for many years. This conference marks his first Summer Conference since assuming the role of Chairman.
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