en.Wedoany.com Reported - On May 7, 2026, Shenzhen MTC Co., Ltd. confirmed that the company has successfully established a vertically integrated industrial chain covering optical chips, optical devices, and optical modules, with coordinated development across all segments and continuously enhanced core competitiveness.
MTC provided a more complete statement on this strategic direction during its annual performance briefing on April 28, 2026: the company has positioned its optical communication business as the core strategic direction for industrial upgrading in 2026, continuously increasing R&D investment and accelerating the development of 1.6T ultra-high-speed optical modules. Currently, optical modules for 200G and below rates have achieved large-scale production and are being shipped in large volumes; 400G and 800G optical modules have entered small-batch production after completing reliability testing and are steadily progressing toward mass production; in terms of next-generation high-speed products, 1.6T optical modules have entered the rapid development stage.
At the most upstream optical chip segment of the industry chain, MTC's technological depth is particularly prominent. The company previously configured 20-chamber MOCVD equipment compatible with both LED gallium arsenide chip and laser chip production lines, and supplemented backend equipment to establish a laser chip production line. As of March 2026, optical chips at 25G DFB and below rates have completed R&D and trial production, gradually transitioning to mass production; high-power series CW DFB laser chips and 50G EML laser chips for 400G, 800G, and 1.6T optical modules are advancing in R&D as planned; Micro LED light source chips for Micro LED optical interconnect CPO technology have completed R&D and are in the sample verification and testing stage. MTC previously clarified in investor interactions that the company possesses mass production capability for 25G DFB laser chips and plans to launch 50G DFB and 100G VCSEL chips in 2026, specifically targeting the passive optical network and data center short-reach optical interconnect module markets.
The large-scale implementation of optical device and optical module manufacturing facilities is progressing simultaneously. The company invested no more than 500 million yuan to construct a high-speed optical module project, and its 50,000-square-meter clean intelligent manufacturing base has been fully operational, where optical modules at 200G and below are being mass-produced. In 2025, the company's optical communication device business achieved operating revenue of 132 million yuan, accounting for 2.27% of the year's total operating revenue.
From a competitive landscape perspective, optical chips at 25G and above rates have long been dominated by overseas manufacturers such as Broadcom and Lumentum from the United States, with a domestic substitution rate of less than 10%. The current explosion in AI computing power is driving a surge in demand for high-speed optical modules, with global optical chips remaining in short supply. MTC leverages its in-house MOCVD production capacity to enter laser chip manufacturing, building a complete vertical chain from epitaxy and chips to devices and modules. This approach can effectively shorten delivery cycles on one hand, and on the other hand, achieving mass production breakthroughs on 25G DFB chips provides a replicable production line foundation for the subsequent large-scale substitution of 50G and higher-speed chips.
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