en.Wedoany.com Reported - On June 25, Chinese chip company GigaDevice launched the GD33AP236x series of automotive-grade SBCs (System Basis Chips). Designed for vehicle electrical control scenarios, this series integrates LDO, power management unit, CAN FD and LIN transceivers, meeting AEC-Q100 Grade 1 automotive-grade requirements. It is suitable for mainstream automotive electronic applications such as Body Domain Controller (BDC), Body Control Module (BCM), Lighting Control, and HVAC (Heating, Ventilation, and Air Conditioning) and Thermal Management Controller.
According to GigaDevice's official product page, its SBC products belong to the analog product line. The chip integrates functions such as a CAN FD transceiver, LIN transceiver, and multiple high-side drivers, providing stable power for automotive MCUs, communication components, sensors, etc., and is used in smart automotive applications like cockpits, body control, and lighting. The GD33AP236x series lists multiple part numbers including GD33AP2361, GD33AP2362, and GD33AP2363. The product selector shows that this series covers different power output combinations, CAN PN support, high-side driver counts, and QFN-48 package options.
Automotive-grade SBCs are typically located at the bottom-level power supply and communication interface of vehicle controllers, connecting the main MCU, vehicle bus, and peripheral actuating components. Unlike a single LDO or transceiver, an SBC integrates power management, communication transceivers, watchdog monitoring, and some driver capabilities into a single chip. This reduces the number of peripheral components, decreases the controller board area, and improves the consistency of system power supply and bus communication. After the GD33AP236x series joins the automotive-grade product lineup, it will form a more complete automotive electronic portfolio alongside GigaDevice's existing automotive-grade MCUs, automotive-grade Flash, and analog products.
Taking the GD33AP2361F5AQC3TR as an example, GigaDevice's product detail page shows that this device is configured with 5V VCC1, 5V VCC2, 5V/3.3V VCC3, supports 1x CAN-FD, CAN PN, Timeout/Window watchdog, 4x high-side drivers, operates over a temperature range of -40°C to 125°C, and comes in a QFN-48 package. The related English datasheet was released on June 12, 2026.
Requirements for chips in scenarios such as body domain control, body control, and lighting control are not solely based on individual performance. Functions like lighting, HVAC, windows, wipers, seats, and thermal management are distributed across different positions in the vehicle. Controllers must face conditions such as temperature variations, electromagnetic interference, bus communication, low-power standby, and abnormal wake-up over the long term. In these systems, the SBC acts as the power entry point, communication interface, and status monitor. If power supply stability or bus compatibility is insufficient, it can affect the vehicle's comfort functions, basic safety functions, and after-sales diagnostic efficiency.
In recent years, GigaDevice has continuously expanded its automotive electronic product line. Its official materials indicate that the company's product portfolio now covers categories such as automotive-grade Flash, automotive MCUs, analog products, and System Basis Chips (SBCs), with automotive listed as one of its key application areas. With the launch of the GD33AP236x series, GigaDevice's layout in basic components for vehicle controllers is further complemented. Customers can now combine MCUs, memory, power management, and vehicle communication interface products within the same supply system for developing body domains, lighting, thermal management, and other low-voltage electrical control units.
As the automotive electronic and electrical architecture evolves from distributed control to domain control, zone control, and central computing, bottom-level node controllers still require a large number of reliable power management and bus interface chips. The launch of the GD33AP236x series signifies that GigaDevice is no longer solely providing automotive-grade devices around main MCUs and memory but is extending further into automotive analog and mixed-signal chips. Going forward, attention should be paid to the adoption progress of this series in OEMs, Tier 1 suppliers, and specific body control projects, as well as the collaborative adaptation between the automotive-grade SBC products and the GD32 automotive-grade MCU platform.
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