en.Wedoany.com Reported - SK Hynix will concentrate the funds raised from its American Depositary Receipt (ADR) listing on expanding artificial intelligence (AI) memory production capacity. The company can raise up to 45.45345 trillion won through the ADR listing, with a total investment scale of 61.9 trillion won, focusing on the Yongin Semiconductor Cluster in Gyeonggi Province, an advanced packaging plant in Cheongju, North Chungcheong Province, and the procurement of extreme ultraviolet (EUV) lithography equipment. Funds raised from the ADR will serve as a partial source, with the remainder supplemented by operating cash flow and borrowings from internal resources.

The total investment for the first-phase wafer fab at the Yongin Semiconductor Cluster is 31 trillion won, of which 4.4 trillion won has already been executed, with plans to invest an additional 26.6 trillion won by 2030. The funds will be disbursed annually, with 7.4 trillion won in 2026, 10.1 trillion won in 2027, 6.6 trillion won in 2028, and 2.5 trillion won in 2029. The wafer fab consists of two frameworks and six cleanrooms, designed to produce high-bandwidth memory (HBM) 4, next-generation HBM, 1c nanometer-class and higher-end DRAM. The facility will adopt EUV processes to increase the number of chips per wafer (Net Die), enhance cost competitiveness, and strengthen supply capabilities to global large-scale tech customers, becoming a key production base for an AI memory-centric product portfolio. The target production start for the first cleanroom has been moved up three months earlier than originally planned, set for February 2027, with the remaining cleanrooms scheduled for completion by the end of 2030.

In Cheongju, a new packaging plant responsible for HBM back-end processes will be built. The total investment for the P&T7 plant, located in the Cheongju Techno Valley Industrial Complex, is 19 trillion won, with approximately 100 billion won already invested and an additional 18.9 trillion won to follow. Construction of the plant began in April, with the goal of completing the cleanroom by the end of next year. P&T7 is an advanced packaging facility essential for HBM manufacturing, including TSV (Through-Silicon Via) and chip stacking, covering everything from site development to equipment installation. The plant is connected to the existing M15 NAND factory and the next-generation DRAM production facility M15X, enabling both front-end and back-end processes within the same cluster. SK Hynix aims to reduce wafer logistics time and improve early HBM yield through this layout. Combined with bases in Icheon, Gyeonggi Province, and Indiana, USA, Cheongju forms a three-axis packaging system and will undertake mass production of new technologies such as next-generation wafer-level packaging (WLP).

For EUV equipment, SK Hynix will invest 11.9 trillion won to acquire EUV scanners, an amount equivalent to a 6.9 billion euro equipment contract. Payments will be made in installments based on individual equipment delivery schedules, with final delivery planned by the end of next year. SK Hynix stated that this investment is not only about expanding production facilities but also aims to build a complete semiconductor ecosystem. The Yongin Cluster will eventually feature four phases of wafer fabs and house over 50 partner companies in materials, components, and equipment. The company's long-term plan is to expand the total investment in the Yongin Cluster to approximately 600 trillion won, establishing a global AI memory production hub centered on HBM and high-end DRAM. Investments in new local production bases, including Gwangju, are not included in this fund utilization plan. The company stated that funds raised through the ADR will be used as specified in the securities registration statement, but the execution plan may be adjusted based on future economic and business environment changes.

This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com