China's Dongfang Jingyuan's STAR Market IPO Accepted, Plans to Raise 2.5 Billion Yuan Focusing on Core Chip Manufacturing Yield Management
en.Wedoany.com Reported - On June 30, the IPO application of Dongfang Jingyuan Microelectronics Technology (Beijing) Co., Ltd. on the STAR Market was accepted by the Shanghai Stock Exchange.
Dongfang Jingyuan focuses on yield management in integrated circuit manufacturing, with its main business covering the R&D, production, and sales of metrology and inspection equipment as well as manufacturing-oriented EDA software. Addressing the pain points of chip manufacturing yield, the company provides comprehensive yield improvement solutions through the combination of hardware and software products.
In the chip manufacturing process, yield directly impacts the production line efficiency and cost of wafer fabs. As advanced process nodes evolve, the requirements for critical dimension metrology, defect inspection, and lithography process optimization in wafer manufacturing continue to increase, highlighting the growing importance of electron beam metrology and inspection equipment and manufacturing-oriented EDA software.
From a product portfolio perspective, Dongfang Jingyuan has established a dual-core system comprising electron beam metrology and inspection equipment and manufacturing-oriented EDA software. The metrology and inspection equipment includes CD-SEM electron beam critical dimension metrology equipment, EBI electron beam defect inspection equipment, and DR-SEM electron beam defect review equipment, primarily applied in front-end processes. The manufacturing-oriented EDA software, represented by computational lithography software, is used to optimize and improve lithography processes, enhancing wafer manufacturing yield.
According to the prospectus, Dongfang Jingyuan is one of the companies with a relatively complete product portfolio and a leading installed base in the domestic electron beam metrology and inspection equipment field. Its main products have secured batch orders from leading domestic customers. The computational lithography software has been applied at multiple well-known clients, positioning the company as a significant force in the domestic semiconductor yield management sector.
High-end metrology and inspection equipment and manufacturing-oriented EDA software are among the most challenging areas for domestic substitution. By focusing on breakthroughs in electron beam metrology and inspection and computational lithography, Dongfang Jingyuan has developed a synergistic solution of "hardware equipment + software algorithms + full-process optimization," offering domestic wafer fabs an independently controllable domestic alternative.
In this IPO, Dongfang Jingyuan plans to raise 2.5 billion yuan, allocated to the high-end semiconductor yield management equipment R&D upgrade and industrialization project (1.42 billion yuan), the computational lithography and design-technology co-optimization EDA tool R&D upgrade project (350 million yuan), and supplementary working capital (730 million yuan).
The fundraising directions continue to focus on the core business, aiming to enhance capabilities in high-end equipment R&D, testing and verification, and scaled delivery, while strengthening computational lithography and design-technology co-optimization EDA tool capabilities to refine the HPO full-process yield optimization solution. Long-term capital market support will provide the company with the backing to navigate R&D and industrialization cycles, helping to enhance the independent controllability of the integrated circuit industry chain.
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