en.Wedoany.com Reported - Asahi Kasei has built a new slitting facility for SUNFORT™ dry film photoresist (DFR) at its Tainan manufacturing base, with construction completed on July 3, and commercial operations scheduled to commence this month.
The factory is equipped with slitting machines and operates under cleanroom standards. The investment amounts to approximately 2 billion yen (about 12 million USD / 11 million EUR), which will increase slitting capacity by 40% and potentially double current output.
SUNFORT™ DFR achieves ultra-high resolution using conventional step-and-repeat exposure systems and laser direct imaging (LDI) systems, transferring circuit patterns onto semiconductor packaging substrates. Asahi Kasei launched SUNFORT™ TA in May 2025, a DFR series designed specifically for advanced semiconductor packaging in AI servers.
Artificial Intelligence-driven increases in data processing volumes have significantly boosted demand for advanced semiconductor packaging, raising higher standards for DFR quality and supply reliability. Taiwan hosts a large concentration of semiconductor packaging-related companies, making a localized, fast, and reliable supply system strategically important. Slitting, the process of cutting master rolls to customer-specified widths, directly impacts product quality and supply reliability.
