en.Wedoany.com Reported - LG Chem recently announced that it will supply semiconductor stripper to Amkor Technology, a global leader in semiconductor packaging and testing, officially entering this niche market and accelerating the scaling of its semiconductor materials business.
Amkor Technology is a global leader specializing in semiconductor packaging and testing services. OSAT (Outsourced Semiconductor Assembly and Test) refers to outsourced semiconductor assembly and test service providers.
Stripper is a core process material used to remove photoresist (PR, photosensitive liquid) and residues from substrates after semiconductor circuit formation. As circuits become increasingly refined, residue removal performance directly impacts product yield and reliability, making stripper technology a key factor in determining semiconductor quality.
Leveraging its technical expertise and customer service experience accumulated in display stripper, LG Chem is expanding into the semiconductor stripper market. Its first semiconductor-grade product has passed rigorous technical certification from Amkor Technology, validating its technological competitiveness.
Under the collaboration, LG Chem will provide customized stripper tailored to Amkor Technology's new production line environment. This product can reduce the removal time of photoresist and residues by up to 50% compared to conventional methods, improving process efficiency.
Recently, with the continued expansion of AI investments and surging demand for High Bandwidth Memory (HBM), investment in advanced packaging has grown rapidly, highlighting the strategic importance of high-performance process materials.
LG Chem CEO Kim Dong-chun stated that through this partnership with Amkor Technology, LG Chem will strengthen the development of customized materials driven by customer process needs and continue to solidify its technological competitive edge.
In March this year, LG Chem announced a strategic plan to more than double the scale of its electronic materials business and is reinforcing its semiconductor packaging material portfolio centered on CCL (Copper Clad Laminate), DAF (Die Attach Film), and PID (Photosensitive Insulating Dielectric), accelerating the cultivation of high-value-added electronic materials businesses.
