GSME and Teradyne to Build Semiconductor Test Center in Silicon Valley, Operational in Q4

en.Wedoany.com Reported - On September 22, GS Microelectronics U.S. (GSME) and Teradyne announced a multi-year strategic partnership to build a semiconductor test and evaluation center at GSME's new headquarters in Silicon Valley, USA. The center is planned to open in the fourth quarter of 2026, followed by customer demonstrations and device evaluations, serving applications including artificial intelligence, silicon photonics, automotive chips, power management, RF, and other emerging semiconductor applications.

The new test center will be located within GSME's new 42,000-square-foot headquarters, equipped with Teradyne automated semiconductor test systems as well as the latest test handlers and probe equipment. GSME will operate an independent test area and provide on-site engineering support to customers. The center's operations include customer demonstrations, device evaluation, engineering development, small-batch pilot production, and technical training, covering multiple stages of the chip transition from R&D validation to volume production readiness.

Both parties will also jointly advance test program development and customer project onboarding. GSME plans to expand its test engineering teams in the United States, Taiwan, Europe, and the Gulf Cooperation Council region to provide customers with design-in support, test program development, and customized application support; GSME and Teradyne will also promote test platform adoption through joint sales, target customer development, technical seminars, and customer exchanges.

Teradyne's existing semiconductor test products cover areas including digital and mixed-signal, wireless, automotive and power devices, memory, and system-level testing, capable of testing standalone integrated circuits, SoCs, and SiP devices. The company recently also launched new test instruments on the UltraFLEXplus platform for AI and data center chips, including test capabilities related to PCIe Gen6, high-current power delivery, and complex test patterns.

GSME is headquartered in San Jose, USA, and operates in Taiwan, Vietnam, and Oman, with business covering RF and analog design, manufacturing introduction, quality assurance, and chip testing. Once completed, the semiconductor test center will consolidate GSME's existing design and manufacturing introduction capabilities with Teradyne's automated test equipment into a single facility.