China Shanghai Xinkewei's 1.05 Billion Yuan Integrated Circuit Materials Project Breaks Ground

en.Wedoany.com Reported - The 30,500-ton-per-year integrated circuit critical process materials project of Shanghai Xinkewei Material Technology Co., Ltd., a wholly-owned subsidiary of Shanghai Sinyang Semiconductor Materials Co., Ltd., has officially broken ground in Shanghai Chemical Industry Park. The project covers approximately 104 mu, with a total investment of 1.05 billion yuan, and is scheduled for completion in June 2028 and production commencement by the end of 2028. The project has been listed as a major construction project in Shanghai for 2026.

The project is planned to establish production capacity for five categories of products, including 500 tons/year of I-line, KrF, and ArF dry/wet photoresist series products, 5,000 tons/year of photoresist thinner, 5,000 tons/year of high-selectivity titanium nitride etchant, 15,000 tons/year of dry etching cleaning solution, and 5,000 tons/year of copper interconnect electroplating solution for chips, totaling an annual production capacity of 30,500 tons.

The project initiated preliminary investment arrangements in February 2023, with an originally planned total investment of approximately 580 million yuan. On August 19, 2026, the board of directors of Shanghai Sinyang deliberated and approved the proposal for capacity layout adjustment and additional investment, raising the total investment to 1.05 billion yuan, with funding sourced from the company's own funds and self-raised funds. After adjustment, the originally planned photoresist thinner capacity of 10,000 tons/year was reduced to 5,000 tons/year, while 5,000 tons/year of copper interconnect electroplating solution capacity for chips was added.

The project implementation entity, Shanghai Xinkewei, is located in Shanghai Chemical Industry Park. Shanghai Sinyang has an existing business foundation in semiconductor wet electronic chemicals and photoresist-related operations. This new construction project will cover integrated circuit manufacturing materials including photoresist, thinner, etchant, cleaning solution, and copper interconnect electroplating solution. The project construction period will last from September 2026 to June 2028, with production planned to commence by the end of 2028 after completion.