Micron Unveils World's First 512GB DDR5 RDIMM, Mass Production in the Second Half of 2027
en.Wedoany.com Reported - On September 15, Micron Technology announced that it has successfully demonstrated the world's first 512GB DDR5 registered DIMM (RDIMM) across multiple server platforms. The module supports data transfer rates of up to 9200 MT/s. AMD and Intel are currently conducting validation for next-generation server platforms, and Micron expects to enter mass production in the second half of 2027 based on customer demand.

The 512GB DDR5 RDIMM uses Micron's vertical interconnect packaging technology, vertically stacking multiple DRAM dies through through-silicon vias (TSVs) to increase storage density within a single DRAM package. According to the currently announced configuration, a dual-socket server equipped with 24 memory slots can be configured with up to 12TB of DDR5 memory. Compared with existing combinations of lower-capacity modules, this expands per-server memory capacity without increasing the number of server slots.
In terms of power consumption, Micron's published test figures show that a single 512GB module operates at approximately 16W, while four 128GB RDIMMs achieving the same 512GB capacity consume approximately 44.2W in total, corresponding to a reduction in operating power consumption of more than 60%. In memory-bound data analysis workloads represented by Spark support vector machines, the 512GB RDIMM can achieve up to approximately 1.4 times the performance of a 256GB DDR5 configuration.
AMD and Intel are both currently in the platform validation stage. AMD is conducting collaborative validation of the module with its next-generation server compute platform; Intel said it is jointly conducting compatibility validation of the 512GB DDR5 RDIMM with Micron, with the goal of supporting future server platforms. The current stage remains one of sample demonstration and ecosystem validation, and commercial volume supply has not yet begun.
Micron has previously advanced lower-capacity high-performance DDR5 RDIMM products. In June 2026, the company demonstrated a 256GB DDR5 RDIMM based on the 1γ process and advanced 3D stacking technology, also supporting up to 9200 MT/s, and has already sent samples to server ecosystem partners. Compared with the 256GB product, this 512GB module further doubles per-module capacity while maintaining a maximum data rate of 9200 MT/s.
Micron's existing DDR5 RDIMM products are mainly aimed at enterprise servers and data centers, and the validation targets for the new-generation 512GB module are likewise concentrated on high-capacity server platforms. According to the application scope announced by the company, the product will cover workloads requiring large-capacity main memory, including AI, in-memory databases, data analytics, virtualization, and simulation.
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