ACM Shanghai Ships First 310 mm Panel-Level Electroplating Equipment

en.Wedoany.com Reported - On October 29, the first 310 mm × 310 mm mass-production panel-level horizontal electroplating equipment, Ultra ECP ap-p, from Chinese semiconductor equipment manufacturer ACM Shanghai, was shipped to an Asian customer outside mainland China. The equipment adopts independently developed horizontal electroplating technology and supports electroplating processes for a variety of metals including copper, nickel, tin-silver, and gold, and is mainly used in advanced semiconductor packaging manufacturing.

The equipment's copper electroplating chamber is equipped with a high-speed electroplating agitation plate, which can achieve within-die coating uniformity at high electroplating rates for copper pillars with a height of 300 micrometers. The system adopts a four-side sealed dry-contact fixture and is equipped with an in-tank rinse function to reduce chemical cross-contamination between different electroplating tanks.

Its horizontal electroplating system adopts technology for which a patent is being applied, enabling the fixture rotation and the rotating rectangular electric field to operate synchronously to control metal deposition uniformity. ACM Shanghai had previously obtained an evaluation order for the 310 mm × 310 mm panel-level horizontal electroplating equipment, originally planned for delivery in the fourth quarter of 2026.