LPKF Germany Announces UV and Ultrashort Pulse Laser Precision Processing Service Solutions

en.Wedoany.com Reported - On November 2, German laser processing technology company LPKF Laser & Electronics presented the precision laser processing service solutions of its LaserMicronics brand through press materials for its participation in electronica 2026, the Munich international trade fair for electronic components. The solutions employ LPKF's independently developed ultraviolet (UV), infrared (IR), and ultrashort pulse (USP) laser systems to provide micro-processing services for the electronics manufacturing, automotive components, and medical device industries, covering process selection, feasibility assessment, and small-batch production.

The processing services offered by LaserMicronics include precision cutting and depaneling of printed circuit boards, micro-via drilling, ceramic micromachining, and patterning of transparent conductive oxide (TCO) and indium tin oxide (ITO) thin films. Ceramic processing services cover cutting, drilling, scribing, engraving, and marking, with the appropriate laser processing system selected according to different materials and component structures.

In printed circuit board processing, LaserMicronics uses UV and ultrashort pulse lasers to handle flexible circuit boards, rigid-flex boards, and thin rigid substrates. The related processes support complex inner and outer contour cutting, processing of materials of different thicknesses, and separation of multilayer composite structures. Technical materials provided by the company show that its non-contact processing method can reduce mechanical load and thermal effects during cutting and, under appropriate process conditions, achieve burr-free cutting, lowering the risk of delamination and micro-cracks.

LaserMicronics' laser micro-via processing services can process micro-vias with diameters as small as 50 micrometers, targeting high-density circuit interconnections and the manufacture of precision electronic components. Its metal micro-part processing services cover sheet cutting of up to 4 millimeters in thickness, while TCO and ITO processing mainly involves the creation of fine insulating patterns on conductive thin films. The company also offers removal services for circuit board solder mask and masking films.

The services involve LaserMicronics application engineers in process development, determining the process route based on the customer's materials, structural dimensions, and processing requirements. Its manufacturing services cover prototype trial production, small-batch processing, and volume production, with operations primarily carried out at two facilities in Garbsen and Fürth, Germany. Customers can commission the company to complete specified precision processing tasks without having to purchase their own UV or ultrashort pulse laser equipment for the relevant processing steps.

LPKF plans to showcase the related manufacturing capabilities at electronica 2026, to be held in Munich, Germany, from November 10 to 13, 2026, at Booth 219 in Hall A2. As of the release of this material, the company has not disclosed the amount of new customer orders, the scale of processing capacity expansion, or plans for new manufacturing facilities associated with this exhibition program.