Broadcom Launches Mass-Market 10G PON and Wi-Fi 8 Chip Solutions to Accelerate Large-Scale Gigabit Broadband Deployment
Palo Alto, California, April 30, 2026 – Broadcom Inc., a global supplier of semiconductor infrastruc...
India's BEL Starts the Year with Orders Worth 569 Billion Rupees, Covering High-Energy Laser and Radar Systems
India's Bharat Electronics Limited submitted a regulatory filing to the National Stock Exchange of I...
Nokia Finland Sells FWA CPE Business to U.S.-based Inseego, Gains 11% Equity Stake and Deepens 6G and AI Collaboration
Espoo, Finland & San Diego, California, USA, April 30, 2026 – Nokia and Inseego today jointly announ...
UK's pureLiFi and Taiwan's Askey Join Forces to Create World's First "All-in-One" LiFi Integrated 5G FWA Device, Tackling the "Last Meter" Bottleneck of Gigabit Broadband
Edinburgh-based optical communication technology pioneer pureLiFi and Taiwanese network equipment ma...
HPE Launches New Generation ProLiant Edge Servers, NPU Collaborates with GPU to Enhance Distributed AI Inference
On April 30, 2026, Hewlett Packard Enterprise, headquartered in Houston, Texas, USA, officially expa...
EMAC USA Announces 2026 Bright Electronics Manufacturing Challenge: Three-Round Format from PCB Design to Robotics Competition
The U.S. Electronics Manufacturing and Assembly Consortium (EMAC) officially launched the second Bri...
RFOptic Launches 8GHz RF over Fiber Link Supporting 5G and C-Band
RFOptic has recently launched an 8.0GHz Radio Frequency over Fiber (RFoF) link to meet customer dema...
u-blox launches GNSS module ZED-X20P-01B achieving decimeter-level accuracy
On April 29, 2026, u-blox officially launched the ZED-X20P-01B full-band GNSS module, which supports...
Woer Material's single-channel 224G high-speed communication cable enters mass production, designed for internal interconnections in AI servers and 1.6T optical modules
Woer Material stated on its investor interaction platform on April 28 that the company's single-chan...
TSMC's Hou Yongqing Stated That to Meet AI Computing Demands, the Company Is Accelerating Capacity Expansion at "Double Speed," With 2nm First-Year Output Expected to Be 45% Higher Than 3nm at the Same Stage
Hou Yongqing, Senior Vice President and Deputy Co-Chief Operating Officer of TSMC, released a key ca...
Lightmatter Appoints Roy Kim as Vice President of Products to Accelerate Mass Deployment of Photonic Interconnect Platform
Photonic supercomputing company Lightmatter officially announced on April 27 the appointment of Roy ...
Moore Threads Q1 Revenue Hits 738 Million Yuan, Up 155%; Annual R&D Spending Reaches 1.305 Billion Yuan, Accounting for Over 86%
Chinese GPU company Moore Threads Intelligent Technology (Beijing) Co., Ltd. disclosed its first-qua...
ZTE Reports Q1 Revenue of 34.99 Billion Yuan, Computing Business Accounts for 27%
ZTE released its first-quarter financial report for 2026 on April 27. During the reporting period, t...
Innodisk Launches Intel Core Ultra Series 3 Edge AI Reference Kit
Innodisk recently announced a joint enablement program with Intel, launching an all-in-one edge comp...
First-Quarter Monitoring by China's Ministry of Commerce Shows that Sales of Smart Glasses on Major Platforms Surged by 460%, with the Product Included in the Trade-in Subsidy Program for the First Time.
The head of the Consumer Promotion Department of China's Ministry of Commerce introduced the operati...
Cisco Unveils Universal Quantum Switch Prototype in the US, Supporting Multiple Modalities
On April 22, Cisco officially released its research prototype, the "Cisco Universal Quantum Switch,"...
TSMC Plans to Launch Advanced Packaging Plant in Arizona by 2029, Bringing CoWoS and 3D-IC Capabilities to the U.S.
Kevin Zhang, Senior Vice President of Global Business and Co-COO of TSMC, stated at an industry conf...
SK Hynix Q1 Revenue Exceeds 52 Trillion Won for the First Time, Expects Favorable Price Environment for DRAM and NAND to Persist
SK Hynix released its financial results for the first quarter of fiscal year 2026, ending March 31, ...
Anker Innovation Releases In-Memory Computing AI Chip 'Thus', Boosting AI Peak Performance 150x Over Traditional Bluetooth Chips
On April 22nd, Anker Innovation held a technology communication meeting in Shenzhen themed "Edge AI:...
Google Launches Eighth-Generation TPU, Splits Training and Inference for the First Time, AI Chips Enter Dual-Architecture Era
Google Cloud officially launched the eighth-generation Tensor Processing Unit (TPU) at the Google Cl...
Intel Officially Proposes the "Agent PC" Concept, Adopting a Hybrid Architecture of Local Assistant Brain and Cloud Main Brain
Intel officially unveiled the "Agent PC" concept in Beijing on April 21st. This product is a new gen...
Cook Appears at Apple Staff Meeting, States He is in Good Health and Will Serve as Apple's Executive Chairman Long-Term
Apple's Executive Chairman Tim Cook stated at the company-wide all-hands meeting on April 21st local...
Apple's Touchscreen MacBook Pro Expected to be Delayed Until 2027 Due to Memory Shortage
Bloomberg journalist Mark Gurman released a new report on April 21, indicating that the launch of Ap...
Apple Announces CEO Transition, Hardware Engineering SVP Ternus to Succeed Cook in September
Apple Inc. issued an official announcement on April 20, local time, stating that John Tenuth, the cu...
SK Hynix Begins Mass Production of 192GB SOCAMM2, Tailored for NVIDIA's Vera Rubin Platform
On April 19, 2026, SK Hynix issued an official statement announcing the commencement of mass product...
TFC Optronics' New Headquarters in Suzhou High-Tech Zone Breaks Ground, Aiming to Produce 1 Million High-Speed Optical Components Annually for AI Computing Power
The groundbreaking ceremony for TFC Optronics' new headquarters (next-generation optical components ...
TSMC and SMIC Respond to Semiconductor Helium Supply Risks; Samsung Says Inventory is Sufficient
Affected by both the Middle East conflict and Russian export controls, the global supply of helium, ...
Congatec Launches Conga-TC300 Module with Intel Core 3 Processor, Integrating 41 TOPS Edge AI Computing Power
Embedded and edge computing technology provider congatec officially launched the conga-TC300 compute...
Apple's Foldable iPhone Supply Chain Layout Revealed, Samsung, Foxconn, and Chinese Suppliers Key Players
Details regarding the supply chain for Apple's first foldable iPhone have recently surfaced intensiv...
China's Q1 Exports of Storage and Central Processing Components Combined Grow 39.1%, Power Equipment Exports See Double-Digit Growth
At a State Council Information Office press conference on April 14, 2026, Wang Jun, Deputy Director ...