en.Wedoany.com Reported - Iceotope Group, a developer of precision liquid cooling technology headquartered in Sheffield, UK, announced on May 14 the completion of a $26 million Series B funding round. The round was co-led by Two Seas Capital and Barclays Climate Ventures, with continued participation from existing investors Edinv, ABC Impact, Northern Gritstone, and British Patient Capital under the British Business Bank. The funds will be specifically used to accelerate product development and engineering iteration, expand the global patent portfolio, and deepen collaboration with key partners within the AI infrastructure ecosystem, in order to match the sharply rising demand for liquid cooling technology in AI data centers.
Iceotope's core technology path can be summarized as a "Direct-to-Everything" precision liquid cooling solution. The system circulates non-flammable dielectric coolant through a sealed chassis design, directly cooling all heat-generating components inside the server, covering memory, storage, networking, and power distribution components beyond just GPUs and CPUs. Official company data shows that compared to traditional air-cooling systems, this solution can reduce energy consumption by up to 40%, water consumption by up to 96%, and cooling costs by up to 83%. The fanless design of the sealed chassis also keeps operating noise below 40 decibels, equivalent to the ambient level of a quiet library.
At the product line level, Iceotope has built a dual-platform matrix covering both data center and edge scenarios. The flagship product, KUL AI, is a liquid-cooled server equipped with 8 GPUs, built on the Gigabyte G293 server platform and Intel Xeon Scalable processors. It holds NVIDIA-Certified Solution status and can support up to a 4x increase in rack-level density, ensuring GPUs operate without throttling under sustained high loads. KUL BOX is an integrated liquid-cooled cabinet designed for edge deployment. A 24U rack integrates 6 KUL AI liquid-cooled servers, networking equipment, 6TB of memory, and 115TB of distributed storage. It can operate using only a standard power outlet, requiring no external water source or dedicated refrigeration facilities, making it suitable for locations lacking traditional data center infrastructure, such as factory floors, hospitals, and telecom base stations. Both products are delivered as pre-assembled and tested full-rack units, with end-to-end deployment services and a three-year warranty provided by UNICOM Engineering.
The funding announcement also disclosed adjustments to the management structure. Co-founder Simon Jesenko recently assumed the role of Interim Chief Executive Officer while continuing to serve concurrently as Chief Financial Officer. Jesenko stated in the announcement that the company has spent years building a differentiated intellectual property portfolio and products specifically designed for AI infrastructure, and with current industry demand exploding, the company is ready for large-scale expansion. Neil Edmunds, a ten-year veteran of the company, has been appointed Chief Innovation Officer. He previously led chip-level liquid cooling validation projects that have achieved reliable cooling for a single chip with a Thermal Design Power of 1500 watts, reserving technical solutions in advance for the cooling demands of next-generation AI accelerators.
Patent reserves are a core pillar for Iceotope in building competitive barriers. Official company materials show it currently holds 219 granted and pending technology patents globally, covering multiple technical levels including chassis architecture, dielectric fluid systems, and rack-level thermal management. Steven Poulter, Head of Barclays Climate Ventures, pointed out that Iceotope's technology not only meets the escalating demands of AI and high-performance computing but also substantively promotes sustainable development in data centers.
The global data center liquid cooling market is standing at an inflection point of explosive growth. According to industry research firm SemiAnalysis, the total installed capacity of liquid-cooled AI accelerators is predicted to climb from the current approximately 3 gigawatts to over 40 gigawatts within two years. Behind this forecast is the reality that AI server rack power density continues to rise, and traditional air-cooling solutions are reaching their physical limits. Iceotope believes that direct-to-chip solutions, which only cool the processor, are no longer sufficient to handle the thermal load of next-generation AI systems. Components like memory, storage, and power distribution also generate significant heat, and the "Direct-to-Everything" technical route is designed precisely to address this gap.
Iceotope has already partnered with Intel, HPE, and nVent to launch a precision liquid cooling solution for telecom edge deployments. This solution, featuring Intel Xeon processors and HPE ProLiant DL110 servers, can save 40% in power consumption compared to similar edge servers. The company has also completed joint validation of a hard drive liquid cooling solution with Meta, and is collaborating with SK Telecom and SK Enmove to develop AI data center liquid cooling solutions. Dell is also listed among its key partners, indicating that its liquid cooling solutions have been embedded into the product matrices of mainstream OEMs.
Founded in 2005, Iceotope focused on applied research in the green computing field for its first decade, subsequently pivoting to specialize in precision liquid cooling for AI infrastructure, high-performance computing, and edge scenarios. The company currently has offices in the US, UK, and several other regions and continues to expand its team size. Looking ahead to the next 12 to 18 months, the company will concentrate its Series B funds on expanding its engineering team, accelerating product iteration, and broadening its global partnership network, with the goal of occupying a key position in the liquid cooling track during an industrial cycle of continuously rising AI computing density.
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