en.Wedoany.com Reported - Hon Hai Technology Group and Intel have announced a strategic partnership, combining Intel's expertise in processors, silicon photonics technology, and software ecosystems with Hon Hai's strengths in global manufacturing, system integration, and AI data center deployment. Together, they will develop comprehensive AI solutions spanning chips, racks, systems, and applications to advance edge and physical AI applications.
In the AI rack domain, the two companies plan to explore and commercialize rack-level AI infrastructure solutions, including rack and AI accelerator architectures based on Intel Xeon processors. The collaboration focuses on key technologies such as high-speed interconnects, thermal and liquid cooling design, system monitoring, and AI data center scalability, aiming to deliver more energy-efficient AI deployment solutions. Both parties will also jointly define next-generation platform architectures, targeting application directions such as agentic AI, edge intelligence, and robotics, driving scenarios in smart manufacturing, smart cities, automotive, and robotics. Additionally, they will explore collaboration opportunities in design services for custom ASICs, SoCs, and system integration, leveraging Intel's chip capabilities and Hon Hai's design and manufacturing ecosystem across chip, module, and system levels to expand global markets.
Young Liu, Chairman of Hon Hai Technology Group, stated that AI is rapidly reshaping global industries and societal operations. Through its "3+3+3" strategy, Hon Hai is deploying AI, semiconductors, and next-generation communication technologies while advancing three major platforms: smart manufacturing, smart electric vehicles, and smart cities. This partnership with Intel will combine their respective advantages in computing platforms, system integration, and global supply chains to jointly build a new generation of AI infrastructure, edge AI, and physical AI ecosystems, accelerating the implementation of AI applications.
Lip-Bu Tan, CEO of Intel, stated that the rapid growth of AI, particularly the rise of large-scale inference and agentic AI workloads, is redefining modern computing capabilities. These demands rely on innovation across the entire technology stack, including next-generation silicon and chip design, rack-level systems, and the deployment of edge AI and physical AI. The collaboration with Hon Hai combines expertise in chip design, rack-level solutions, and global system integration, accelerating the development of end-to-end platforms to unlock new capabilities and expand AI's global impact.
This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com
