en.Wedoany.com Reported - China Huahan Weiye has launched the Zeus HS3000, an AOI inspection equipment for post-TGV etching. This device utilizes three-sided synchronous imaging technology and AI intelligent algorithms, aiming to solve the difficulty of inspecting deep hole structures in the etching process of high-density Through Glass Vias (TGV).
In the TGV industry chain, etching is the core process that determines the geometry and electrical performance of the vias. The precision of via morphology and positional consistency directly impact the yield of subsequent electroplating and bonding processes. Conventional planar inspection solutions struggle to meet the quality control requirements of three-dimensional deep hole structures. Common pain points faced by the industry include: blind spots in the inspection of 3D structures; difficulty in ensuring nanoscale measurement accuracy, as ordinary equipment is susceptible to environmental thermal drift; insufficient efficiency and stability in defect classification, with manual classification being highly subjective and inefficient; and data silos hindering process optimization.
To address these pain points, the Zeus HS3000 employs three-sided synchronous imaging technology to simultaneously capture images of the top, waist, and bottom of the vias in a single exposure. Combined with full top and bottom surface inspection capability, it eliminates blind spots in deep hole structure inspection. The device incorporates a self-developed AI algorithm that can automatically extract defect features and classify them, achieving an overall detection accuracy of no less than 99%. Its inspection scope covers typical hole defects such as missing vias, non-through vias, and foreign matter inside vias, as well as board surface defects including scratches, contamination, cracks, and etching pits. It also supports dimensional measurements such as surface hole diameter/circularity, waist hole diameter/circularity, hole position accuracy, and concentricity of top and bottom surface holes.
In terms of process monitoring, the equipment can generate Mapping distribution charts for dimensions and geometric tolerances, visualizing etching process fluctuations and triggering alerts. Its via position accuracy detection is less than 1 micron, aiding production lines in quickly locating process issues. The device also supports cross-process data interconnection, linking inspection data with the front-end etching process to help build a closed-loop quality control system.
The device is available in fully automatic and semi-automatic models. The fully automatic model is equipped with an EFEM automatic loading/unloading module, suitable for high-volume automated production lines handling 510mm x 515mm panels and 6-inch, 8-inch, and 12-inch glass wafers. The semi-automatic model features a lightweight frame design with manual assisted loading/unloading.
Addressing process challenges of TGV glass substrates such as transparency, high reflectivity, and high aspect ratio micro-vias, Huahan Weiye has developed a closed-loop AOI inspection system covering the entire process: incoming material screening, laser-induced processes, chemical etching, PVD electroplating metallization, and RDL redistribution layer.
