en.Wedoany.com Reported - Innodisk will demonstrate the operational efficiency and full-stack underlying support capabilities of edge AI in complex scenarios through two dynamic live demonstrations at booth H1-D715 of the Shanghai World Expo Exhibition and Convention Center during WAIC 2026, held from July 17 to 20, 2026.

The deployment of edge AI is shifting from a competition in computing power to system-level engineering validation. In the first dynamic demonstration, Innodisk will showcase the APEX-A100 rugged edge AI system based on the Qualcomm Dragonwing IQ-9075 platform. This system delivers up to 100 TOPS (Dense) of computing power, supports fanless operation in a wide temperature range from -40°C to 70°C, and can smoothly run the LLaVA 7B vision-language model at the edge. The system can accurately detect smoke, flames, and personal protective equipment violations, while generating real-time image-to-text analysis and automatically triggering alarms, endowing industrial sites with scene awareness capabilities. The Qualcomm chipset is committed to long-term supply until 2038, ensuring long-cycle project maintenance.

The second dynamic demonstration focuses on SoC heterogeneous computing. Innodisk will exhibit an Edge AI system based on the Intel Panther Lake-H platform, which deeply integrates the CPU, Xe3 integrated GPU, and NPU 4.0, achieving a peak computing power of 180 pTOPS. Without the need for an additional discrete accelerator card, the system can process 16 independent 4K HD video streams in real time while supporting parallel inference of multiple AI models. This aims to reduce hardware procurement costs and power consumption at edge nodes, redefining the energy efficiency ratio and scalability in high-concurrency multi-channel scenarios.

In addition to core computing systems, Innodisk will also showcase a full-stack hardware module lineup, including forward-looking memory products such as 12800 MT/s MRDIMM, SOCAMM2, and CXL 2.0 memory expansion cards, EDSFF or U.2 data center-grade SSDs and 218-layer 3D TLC industrial-grade storage solutions, the world's first M.2 interface SFP+ network expansion module (supporting 10GbE), and an industrial camera matrix covering full interfaces including MIPI over Type-C.

The exhibition will take place from July 17 to July 20, 2026, at the Shanghai World Expo Exhibition and Convention Center, with Innodisk's booth located at H1-D715.