en.Wedoany.com Reported - Recently, Bomin Electronics Co., Ltd., a Chinese printed circuit board (PCB) manufacturer, and Huagong Tech Co., Ltd., a Chinese laser and optical communication technology enterprise, signed a three-year strategic cooperation agreement. The two parties will collaborate in the fields of optical module PCBs and ceramic substrates, aiming to establish a more long-term and stable supply chain partnership centered on the upgrade of high-speed optical modules driven by AI computing power demands.
The focus of this agreement is clear: on one end, optical module manufacturers have a continuous demand for key materials such as high-end PCBs and ceramic substrates; on the other end, PCB companies seek to further scale up high-end products that have already entered the verification and supply stages. The construction of AI data centers is driving the growth in demand for 400G, 800G, and higher-rate optical modules, simultaneously raising requirements for high-frequency and high-speed transmission, heat dissipation, dimensional control, and reliability within the modules. Optical module PCBs are not just ordinary circuit carriers; they directly impact the quality of high-speed signal transmission, device integration density, and product consistency. Ceramic substrates play a crucial role in thermal management, stability, and high-reliability packaging. By locking in a three-year cooperation cycle, Bomin Electronics and Huagong Tech aim to advance from a single-supply relationship to a more stable partnership involving product certification, procurement coordination, and capacity alignment.
Bomin Electronics has already had some products enter Huagong Tech's supply system. Specifically, HDI products for 400G/800G optical modules have achieved stable supply to Huagong Tech, while high-end MSAP products for optical modules are currently in the capacity ramp-up phase, with commercialization progressing. HDI products emphasize high-density interconnection capabilities, suitable for the more compact and complex wiring needs within optical modules; the MSAP process corresponds to finer line manufacturing capabilities, helping to improve signal integrity and manufacturing consistency of high-end optical module PCBs. As optical module speeds increase, line precision, interlayer interconnection, impedance control, material stability, and batch yield will all become key criteria for customers when selecting suppliers.
Ceramic substrates represent another core area of cooperation. Bomin Electronics' DPC/TFC ceramic substrate products have indirectly entered the supply chain of leading optical module customers in the industry, with their product processes and reliability gaining market recognition. DPC ceramic substrates are typically used in high thermal conductivity and high-reliability packaging scenarios, while TFC ceramic substrates are also applied in optical communications and related high-end devices. As the power density of optical modules increases, heat dissipation and packaging stability are no longer just supporting aspects; they affect module lifespan, performance stability, and system operational reliability. Huagong Tech's inclusion of ceramic substrates in the three-year cooperation scope indicates that the partnership extends beyond existing PCB supply to encompass higher-end materials and packaging support capabilities.
Over the next three years, the two parties will work to make Bomin Electronics a core supplier in Huagong Tech's procurement system for optical module PCBs and ceramic substrates. For mature products that have already passed certification, Huagong Tech will prioritize procurement under equal conditions, providing order support for the continued scaling of Bomin Electronics' high-end products. This arrangement has a direct impact on supply chain stability: optical module products iterate quickly, and customers have high requirements for delivery cycles, batch consistency, and process response speed. A long-term agreement can reduce uncertainties caused by repeated certification and supply switching, and also helps suppliers arrange capacity, process optimization, and material stocking in advance.
The construction of AI computing power is transmitting demand pressure from the optical communication industry to upstream materials and manufacturing links. As high-speed optical modules evolve from 400G to 800G and 1.6T, PCBs, substrates, optical devices, packaging, heat dissipation, and testing will all be upgraded simultaneously. Huagong Tech, as an important player in the optical module industry chain, requires a more stable supply of high-end PCBs and ceramic substrates; Bomin Electronics, through its already-supplied products, ramp-up products, and ceramic substrate verification foundation, aims to secure a higher share in Huagong Tech's procurement system. The three-year cooperation agreement signed by the two parties effectively integrates product certification, procurement priority, capacity ramp-up, and high-end material introduction into a single collaborative chain.
This cooperation will be directly reflected in the procurement of mature products, the release of capacity for high-end products, and the progress of ceramic substrate introduction. HDI products for 400G/800G optical modules have already formed a stable supply, high-end MSAP products are in the ramp-up phase, and DPC/TFC ceramic substrates have the foundation to enter larger-scale applications. As AI data centers continue to drive demand for high-speed optical modules, the three-year cooperation between Bomin Electronics and Huagong Tech will focus on supply stability, process maturity, and the scaling of high-end products.
