en.Wedoany.com Reported - Hubei Star Technology Co., Ltd. announced the completion of its Series A financing round, raising over 4 billion yuan, setting a record for the largest single financing in the domestic advanced packaging sector in 2026. The investors in this round have not been disclosed yet. Formerly the technology transfer and industrial service platform of Jiangcheng Laboratory (one of the top ten laboratories in Hubei), Hubei Star became an independent entity in 2021. Currently, Jingce Electronic (300567.SZ) holds approximately a 17% stake.
The company focuses on pilot-scale services for high-density integrated advanced packaging. Total investment in its first and second phases has exceeded 7 billion yuan, with a planned monthly production capacity of 20,000 wafers, aiming to build the largest advanced packaging pilot platform in China. Operational data shows the company's revenue was approximately 210 million yuan in 2023, surpassing 250 million yuan in 2024, with a net profit exceeding 80 million yuan. As of April 2025, the company has signed long-term cooperation contracts worth approximately 3 billion yuan.
In its early stages, Hubei Star did not rush to build its own production lines. Instead, it leased idle equipment from the industry to provide customized advanced packaging process development services for chip design companies. Two years later, with the rapid growth in demand for AI chips, many chip design companies had mature product solutions but were bottlenecked by the advanced packaging stage. Consequently, Hubei Star shifted towards an asset-heavy strategy. To date, the company has facilitated the pilot-scale validation of nearly 30 high-performance chips. Once the project is fully operational, annual revenue from R&D and foundry services is expected to reach 2.7 billion yuan. Now, with the completion of this over 4 billion yuan Series A financing, the company that started by leasing equipment has become the firm receiving the largest single financing in the domestic advanced packaging track this year.
In the AI era, demand for advanced packaging is rising, but the investment threshold is extremely high. A 12-inch advanced packaging production line typically requires an investment of 4 to 5 billion yuan. Most chip design companies lack both the capital and the necessity to build their own lines, rapidly increasing the value of specialized pilot platforms. Since the beginning of this year, packaging and testing companies such as JCET, Tongfu Microelectronics, Huatian Technology, and Yongxi Electronics have been continuously expanding capacity, announcing cumulative investments exceeding 27 billion yuan in the first half of the year. However, building new capacity generally takes 18 to 24 months, and pilot-scale validation capabilities remain scarce, creating stronger market demand for third-party platforms like Hubei Star. Looking at other opportunities, the equipment segment shows the clearest growth prospects, with orders for temporary bonding, hybrid bonding, and high-precision inspection equipment continuing to rise. Among these, inspection equipment still has significant potential for domestic substitution. In terms of materials, high-end products like temporary bonding adhesives and CMP slurries are still primarily imported. Once customer validation is completed, there is potential for entry into long-term supply systems.
