en.Wedoany.com Reported - China Hubei Xingchen Technology Co., Ltd. has completed the arrival of the first batch of core process equipment for its advanced packaging Phase II pilot line, marking the project's entry into the equipment installation and commissioning stage. The line is scheduled to achieve full integration by September 2026. With a total investment of 4.58 billion yuan, the project took nine months from pile foundation construction to equipment arrival. Once operational, it can concurrently undertake process pilot runs and risk mass production tasks for 40 to 50 chips, and provide performance verification conditions for 30 to 40 sets of Chinese domestic semiconductor equipment and materials. The company recently completed a Series A financing round totaling over 4 billion yuan, with relevant industrial and commercial change procedures currently underway.
The cumulative investment in China Hubei Xingchen's Phase I and Phase II projects exceeds 7 billion yuan, with an overall planned monthly production capacity of 20,000 wafers, aiming to build a high-density integrated packaging pilot platform. The production line will primarily serve high-performance artificial intelligence computing chips, smart terminal chips, sensing-memory-computing integrated chips, and optoelectronic integrated chips, providing chip design companies with packaging process development, pilot verification, and risk mass production services. According to the company's estimates, after the Phase II project becomes operational, it is expected to generate approximately 2.7 billion yuan in annual R&D and foundry service revenue.
Unlike packaging companies that directly produce finished chips, Hubei Xingchen primarily undertakes the verification stage of advanced packaging processes transitioning from laboratory results to industrial production. Chip design companies can use this platform for process development, small-batch trial production, and pre-mass production verification, while semiconductor equipment and materials companies can integrate their products into a real production line environment to test stability, process compatibility, and production performance. This model enables the same production line to simultaneously handle chip process pilot runs, risk mass production, and verification of domestic equipment and materials.
Hubei Xingchen's Phase I advanced packaging comprehensive experimental platform was completed in 2024, also taking nine months from construction start to operation. It can simultaneously support 8 to 10 chip process R&D pilot runs and the verification of 10 sets of semiconductor equipment and materials. To date, the company has assisted nearly 30 high-performance chips in completing process pilot runs and completed performance verification for 35 sets of Chinese domestic semiconductor equipment. After the Phase II project becomes operational, the number of chip projects and equipment verifications the platform can undertake will further expand.
In terms of equipment co-development, China Hubei Xingchen has established production line verification mechanisms with multiple semiconductor equipment companies. The company has collaborated with China XinFeng Precision to integrate wafer thinning, tape removal, and tape lamination processes into a single piece of equipment, which enters the market after production line verification. Equipment co-developed with China NAURA took less than a year from requirement initiation to verification completion, with cumulative shipments exceeding 30 units. Such collaborations enable the advanced packaging production line to simultaneously serve process R&D and the industrialization verification of domestic equipment.
Hubei Xingchen was formerly the technology transfer and industrial service carrier of China Jiangcheng Laboratory, later transforming into an independently operated industrialization entity. In 2024, the company received 500 million yuan in strategic investment, with investors including China Hubei Jingce Electronic Group. The Phase II pilot line's entry into the equipment installation and commissioning stage signifies that the company's advanced packaging platform construction is extending from Phase I's comprehensive experimental capabilities towards scaled pilot runs and risk mass production capabilities.
