BASF to Launch Next-Generation Recyclable Packaging Solutions at Interpack 2026
2026-04-20 10:41
Favorite

en.Wedoany.com Reported - BASF and its European distribution organization, BTC Europe, plan to introduce a series of sustainable packaging innovations at the interpack trade fair for packaging technology, to be held from May 7 to 13, 2026, in Düsseldorf, Germany. The company's showcase will focus on material innovations, recyclability-compatible systems, and eco-friendly packaging concepts to address regulatory changes and industry demands.BASF Sustainable Packaging Solutions

Core products on display will include Ultramid Ccycled, a polyamide solution suitable for food and sensitive applications, and the newly introduced Ultramid H, described as the first thermoplastic polyamide offering high water vapor permeability. Additionally, BASF will present various adhesive technologies aimed at enhancing the recyclability of different packaging formats, such as the Epotal® lamination adhesive for PET multilayer separation, and the acResin and Acronal RCF systems designed to facilitate label removal from PET, glass, paper, and cardboard.

In the area of printing and coating, BASF will showcase water-based Joncryl resins specifically designed for repulpable and recyclability-compatible packaging, while also reducing CO2 emissions through bio-based and chemically recycled feedstocks. The company will also launch ecovio, a certified home-compostable biopolymer suitable for flexible and rigid packaging ranging from ultrathin films to high-barrier fast-moving consumer goods, compatible with organic and paper recycling streams.

According to BASF, these sustainable packaging solutions aim to cover the entire packaging value chain and align with frameworks such as the EU Packaging and Packaging Waste Regulation (PPWR). They offer multiple end-of-life pathways, such as organic and mechanical recycling, and target industries including food, pet food, pharmaceuticals, cosmetics, and industrial goods.

This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com